Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic circuit board having heat dissipation function

An electronic circuit board and circuit board technology, which is applied in the direction of electrical components, magnetic field/electric field shielding, cooling/ventilation/heating transformation, etc., can solve problems such as insufficient protection ability, damage to circuit board lines, and burnt out components. The effect of insufficient protection

Inactive Publication Date: 2019-05-31
GUILIN JIAHONG ELECTRONICS TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing electronic circuit board itself does not have the heat dissipation function, which may easily cause the components on the circuit board to be overheated, affect the operation of the components, or even burn out the components, and the protection of the dense lines on the circuit board Insufficient capacity makes it easy to cause electrostatic breakdown, damage the lines on the circuit board, and cause components to fail, causing unnecessary losses

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic circuit board having heat dissipation function
  • Electronic circuit board having heat dissipation function
  • Electronic circuit board having heat dissipation function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] see Figure 1-3 , the present invention provides a technical solution: an electronic circuit board with heat dissipation function, including a radiator 1 and a circuit board 5, the radiator 1 is provided with a circuit board 5, and the circuit board 5 is embedded in the radiator 1, The interior of the radiator 1 is provided with a vent 102, and the vent 102 is embedded in the radiator 1, the interior of the radiator 1 is provided with a bottom plate 103...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electronic circuit board having a heat dissipation function. The electronic circuit board comprises a heat sink and a circuit board. The circuit board is disposed in the heat sink and is embedded in the heat sink. An ion fan generates wind power to take away the heat of components and blow off the ions in the air, thereby avoiding overheating and burning out the components and preventing the ions in the air from damaging component circuits. An air circulation port makes the wind power generated by the ion fan form a circulating airflow so as to enhance the utilization of the wind power generated by the ion fan. A circuit protection layer is configured to protect the component circuits on the circuit board, to isolate the component circuits from the air, and to prevent static electricity in the air from causing short circuits to the component circuits. Heat dissipation holes exhaust the heat-loaded airflow out of the heat sink to form the circulating airflow.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an electronic circuit board with heat dissipation function. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc., circuit boards make circuits miniaturized and intuitive, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards can be called printed circuit boards or printed circuit boards. Circuit board, the English name is PCB, FPC circuit board and soft-hard combination board, soft-hard combination board, that is, flexible circuit board and rigid circuit board, after pre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K9/00
Inventor 杨松
Owner GUILIN JIAHONG ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products