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Semiconductor lighting device

A technology for lighting equipment and semiconductors, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, lighting devices, etc. coupling effect

Inactive Publication Date: 2019-06-04
湖南正美光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve this problem, most semiconductor lighting devices are equipped with radiators, which solve the problem of heat dissipation to a certain extent. However, in the structure of existing semiconductor lighting devices, the semiconductor light source accommodating cavity and the driving power accommodating cavity are usually directly connected to each other. Connection, because the heat generated by the semiconductor light source is easy to be thermally coupled with the heat generated by the driving power supply, and it is not easy to dissipate, so that the internal temperature of the semiconductor lighting device remains high for a long time, which damages the life of the semiconductor light source

Method used

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Embodiment Construction

[0021] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] Such as Figure 1 to Figure 4 The shown semiconductor lighting equipment includes a semiconductor light source housing chamber 1 and a power supply housing chamber 2, a semiconductor light source 3 is arranged in the semiconductor light source housing chamber 1, a heat dissipation part is arranged in the semiconductor light source housing chamber 1, and the heat dissipation part is composed of multiple groups of heat dissipation fins The first side 9 of the semiconductor light source accommodating cavity 1 is the light-emitting surface, the back of the first side 9 is the second side 7, and the first side 9 and the second side 7 Have a common side end surface 10, the first side 9 and the second side 7 are connected...

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Abstract

The invention provides a semiconductor lighting device. The semiconductor lighting device comprises a semiconductor light source accommodating cavity and a power supply accommodating cavity, wherein semiconductor light sources are arranged in the semiconductor light source accommodating cavity, the semiconductor light source accommodating cavity is provided with a heat dissipating part, the heat dissipating part is composed of a plurality of groups of heat dissipating fins, a driving power supply is mounted in the power supply accommodating cavity, a first side face of the semiconductor lightsource accommodating cavity is a light outgoing face, the back side of the first side face is a second side face, and the power supply accommodating cavity and a second side face of the semiconductorlight source accommodating cavity are connected through a connecting structure. For the semiconductor lighting device adopting the technical scheme, heat generated by the semiconductor light sources can be rapidly transmitted to the heat dissipating part, so that the heat dissipating efficiency is improved, and meanwhile, the thermal coupling between the heat generated by the semiconductor light sources and the heat generated by the driving power supply also can be avoided, so that the service life of the LED lamp is greatly prolonged.

Description

technical field [0001] The invention belongs to semiconductor lighting technology, in particular to a semiconductor lighting device. Background technique [0002] Semiconductor lighting is a new type of lighting equipment, which has the characteristics of high luminous efficiency, long life, fast start-up speed, safety, energy saving and environmental protection, shock resistance and pressure resistance, and easy control. During the operation of semiconductor lighting equipment, the semiconductor light source will generate a lot of heat. If the heat is not discharged in time, it will affect the service life of the semiconductor light source, which is also the main factor affecting the service life of the semiconductor lighting equipment. [0003] In order to solve this problem, most semiconductor lighting devices are equipped with radiators, which solve the problem of heat dissipation to a certain extent. However, in the structure of existing semiconductor lighting devices, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21V29/503F21V29/76F21V29/83F21Y115/10
Inventor 刘汉平刘林峰刘燕米玖帆
Owner 湖南正美光电科技有限公司
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