Panel carrying device and bonding equipment
A technology for carrying devices and panels, used in semiconductor devices, electrical components, circuits, etc., can solve problems such as easy generation of bubbles and cracks
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[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.
[0028] Aiming at the problem that in the existing bonding process, the panels are prone to bubbles and cracks when they are squeezed, and the specification of the bonding fixture is single, which can only be used for bonding medium-sized panels, this embodiment provides a panel carrying device ,Such as figure 1 shown, including:
[0029] The liquid bag 1 for accommodating liquid has a bea...
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