Wafer taking-out device

Abstract

The invention provides a wafer taking-out device. The wafer taking-out device comprises a disc body, a plurality of ejector rods, at least three grabbing hooks and a handle, wherein the plurality of ejector rods are radially connected to the disc body through a first telescopic device; the grabbing hooks are radially connected to the disc body through a second telescopic device, and are staggeredwith the plurality of ejector rods in the horizontal direction; and the handle is perpendicularly connected to the center of the disc body, is connected with the first telescopic device and the secondtelescopic device in an operable manner, and is used for controlling the plurality of ejector rods and the at least three grabbing hooks to extend out and retract in the radial direction of the discbody. The wafer taking-out device has the beneficial effects that the handle is connected with the first telescopic device and the second telescopic device in an operable manner to control the plurality of ejector rods and the at least three grabbing hooks to extend out and retract in the radial direction of the disc body, so that a wafer can be taken out without touching the wafer by hands; and moreover, the wafer taking-out device is simple in structure, convenient to operate and high in safety.

Description

technical field [0001] The present invention relates to the technical field of semiconductor processing, and in particular, to a wafer extraction device. Background technique [0002] At present, in the process of cleaning and etching the wafer, the wafer is usually transferred into the cavity and fixed by a plurality of fixing pins to clean and etch the wafer, and the cavity has a small gap, and usually Automatic transfer to achieve wafer pickup. [0003] In the prior art, in the process of cleaning and etching the wafer, when the cleaning and etching machine fails, the cleaning and etching machine cannot take the wafer through its own transfer function, and can only take it by hand. Take the wafer, but the gap of the cavity is small, it is difficult to take the wafer manually, and the hand transfer may leave fingerprints on the wafer, resulting in wafer defects and even hand injuries; and the hand touches the wafer It is easy to cause damage to the surface of the wafer, ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, in the process of wafer cleaning and etching, when the cleaning and etching machine breaks down, the cleaning and etching machine cannot pick up the wafer through its own transfer function, and can only be taken by hand Take the wafer, but the gap in the cavity is small, it is difficult to take the wafer manually, and passing it by hand may leave fingerprints on the wafer, causing wafer defects and may even cause human hands to be injured; and the hand touches the wafer When the wafer surface is easily damaged, the wafer cannot be used normally, thereby affecting the production of the factory.

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