Integrated circuit packaging board and mounting device thereof

An integrated circuit and packaging board technology, which is applied in the field of integrated circuit packaging boards and their mounters, can solve the problems of poor heat dissipation effect of integrated circuit packaging boards and poor mounting effect of the mounter, and achieves good heat dissipation, convenient assembly, and good heat dissipation. Effect

Active Publication Date: 2019-06-14
王晓青
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit packaging board and its installer, wh

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  • Integrated circuit packaging board and mounting device thereof
  • Integrated circuit packaging board and mounting device thereof
  • Integrated circuit packaging board and mounting device thereof

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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-3 , the present invention provides a technical solution: an integrated circuit packaging board and its installer, comprising an integrated circuit packaging board 1 and an installation workbench 2, the integrated circuit packaging board 1 is placed on the installation workbench 2, and the integrated circuit packaging board 1 Including bottom plate 101, substrate 102, heat dissipation graphite film layer 104 and top plate 105, bottom plate ...

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Abstract

The invention discloses an integrated circuit packaging board and a mounting device thereof. The integrated circuit packaging board comprises an integrated circuit packaging board and a mounting workbench, wherein the integrated circuit packaging board is placed on the mounting workbench, and the integrated circuit packaging board comprises a bottom board, a substrate, a heat dissipation graphitefilm layer and a top board, wherein the bottom board, the substrate, the heat dissipation graphite film layer and the top plate are sequentially arranged from bottom to top; an IC chip mounting grooveis formed in the middle of the heat dissipation graphite film layer and the top board, and an IC chip is placed at the top of the IC chip mounting groove; and a pin hole is formed in the lower portion of the IC chip, and a heat conduction silica gel sheet is arranged above the IC chip. The invention relates to the technical field of integrated circuit packaging boards. According to the integratedcircuit packaging board and the mounting device thereof, the heat dissipation of the integrated circuit packaging board is high, and the mounting is convenient; the packaging board with the compositeheat conduction structure and a heat dissipation cover on the packaging board are higher in heat dissipation efficiency, so that the service life of the IC chip is prolonged, the force of pressing down a pressing type disc rubber disc is reduced, and damage is prevented.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit package board and a mounter thereof. Background technique [0002] The electronic industry continues to reduce the size of electronic components and increase the functions of electronic components, which makes the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop towards the direction of small size, high pin count and high electrical / thermal performance, and conforms to predetermined industrial standards. Some existing integrated circuit packages are composed of substrates, IC chips and corresponding packaging glue. IC chips are sealed and fixed on the substrate through the packaging glue, and then wired on the upper part of the substrate. Although this structure is convenient and quick to package, the heat dissipation effect is poor. ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L23/10H01L23/367H01L23/373
Inventor 任飞
Owner 王晓青
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