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OLED packaging structure, packaging method, and electronic device

A packaging structure and packaging method technology, which is applied in the direction of electric solid-state devices, electrical components, semiconductor devices, etc., can solve the problems of easy peeling off of the film layer, and achieve the effects of avoiding film layer peeling off, reducing delamination, and improving the effectiveness of packaging

Inactive Publication Date: 2019-06-21
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention aims at the problem that the film layer is easy to fall off after the OLED device is packaged in the prior art, and provides an OLED package structure, a package method and an electronic device

Method used

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  • OLED packaging structure, packaging method, and electronic device
  • OLED packaging structure, packaging method, and electronic device
  • OLED packaging structure, packaging method, and electronic device

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Embodiment Construction

[0024] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0025] The drawings and descriptions are to be regarded as illustrative in nature and not restrictive. In the figures, structurally similar elements are denoted by the same reference numerals. In addition, the size and thickness of each component shown in the drawings are arbitrarily shown for understanding and ease of description, but the present invention is not lim...

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PUM

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Abstract

The invention provides a packaging structure, a packaging method, and an electronic device. The packaging structure comprises an inorganic layer and an organic layer, wherein a rivet-shaped structureis formed in the inorganic layer, and the inorganic layer is connected with the organic layer through rivet effects of the rivet-shaped structure. The packaging structure, the packaging method and theelectronic device provided by the invention have the advantages that the inorganic layer of an OLED device is prepared into the rivet-shaped structure and connected with the organic layer of the OLEDdevice through the rivet effects, so that separation between the inorganic layer and the organic layer can be reduced, the film layers can be prevented from dropping, the OLED device packaging effectiveness can be improved, and the service life of the OLED device can be further effectively prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED packaging structure, a packaging method and an electronic device. Background technique [0002] In the field of display technology, flat panel display technologies such as liquid crystal display (LCD, Liquid Crystal Display) and organic light-emitting diode (OLED, Organic Light-Emitting Diode) displays have gradually replaced cathode ray tube (CRT, Cathode Ray Tube) displays. Among them, OLED has many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide temperature range, flexible display and large-area full-color display, etc. It is widely used in mobile phone screens, computer monitors, full-color TVs, etc., and is recognized by the industry as the most promising display device. [0003] The OLED display includes an organic light emitting unit including a...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
Inventor 王蕊李辉
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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