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THINWALL COMPOSITES FOR ELECTRONIC ENCLOSURES AND OTHER DEVICes

A skin, fabric technology for thin-walled composites that addresses undesired performance and cost trade-offs

Inactive Publication Date: 2019-06-25
SABIC GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, efforts to make thinner and lighter casings using different materials and production methods create undesired performance and cost tradeoffs

Method used

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  • THINWALL COMPOSITES FOR ELECTRONIC ENCLOSURES AND OTHER DEVICes
  • THINWALL COMPOSITES FOR ELECTRONIC ENCLOSURES AND OTHER DEVICes
  • THINWALL COMPOSITES FOR ELECTRONIC ENCLOSURES AND OTHER DEVICes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0071] Perform a set of multi-span bending tests to evaluate the effectiveness of the A-B-A configuration. Laminated in a vacuum assisted press (vacuumassisted press) from a single 0.25mm Tencate CETEX TC 925FST outer layer (type 7581 alkali-free glass in a polycarbonate matrix, with 50vol% load and 0.24mm thickness) and 0.50mm Enhanced LEXAN TM Thin-walled sandwich composite composed of 8B35 core. The overall laminate thickness is 1.00 mm and the core / outer layer thickness ratio is 0.50. The nominal flexural dimension is 25mm×100mm. The samples were tested in four spans to eliminate geometric and shear related effects. The samples were also tested from three directions to test anisotropy. In particular, the curved samples were machined in directions corresponding to the "warp", "weft" and "off" orientations of the outer layer. TC 925 FST uses 7581 alkali-free glass fabric. This is an 8-warp satin with a relatively "balanced" structure. Produce directional samples to he...

Embodiment approach 1

[0089] Embodiment 1: An ABA structure comprising: a core layer including a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness, and wherein the core layer includes at least one of the following: (i) The through-surface thermal conductivity of 0.1W / mK or more, and (ii) the core layer density (X), X≥0.8Y; the first outer layer containing the second thermoplastic material on the first side of the core layer; and the core layer A second outer layer comprising a second thermoplastic material on the second side of the layer, the second side opposite to the first side; wherein the core thickness is 30% to 75% of the total thickness of the ABA structure.

Embodiment approach 2

[0090] Embodiment 2: The structure according to Embodiment 1, wherein the total thickness is 0.5 mm to 1.5 mm, preferably 0.5 mm to 1.25 mm or 0.75 mm to 1.1 mm.

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Abstract

The invention relates to a thinwall composites for electronic enclosures and other devices. In an embodiment, an A-B-A structure, can comprise: a core layer comprising a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness and wherein the core layer comprise at least one of (i) a through plane thermal conductivity of greater than equal to 0.1 W / mK, and (ii) a core layer density (X) that is X>=0.8Y; a first outer layer comprising a second thermoplastic material located on a first side of the core layer; and a second outer layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core thickness is 30% to 75% of a total thickness of the A-B-A structure.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 201580037088.7 entitled "Thin-walled Composites for Electronic Housing and Other Devices" on July 9, 2015. Technical field [0002] The present invention relates to the technical field of material chemistry, and in particular to a thin-walled composite used for electronic casings and other devices. Background technique [0003] Housings used for electronic devices such as notebook computers, pen-touch computers, and cell phone housings can benefit from certain mechanical properties. For example, the industry tends to benefit from thin, lightweight housings that can be manufactured at low cost. In an attempt to meet industrial needs, various materials are used for electronic device housings. However, the effort to make thinner and lighter housings using different materials and production methods creates undesirable performance and cost trade-offs. [0004] US Patent No. 8,372,495 discloses a housi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/20B32B27/28B32B27/32B32B27/34B32B27/36B32B1/00B32B7/02
CPCB32B27/08B32B27/20B32B27/281B32B27/286B32B27/288B32B27/32B32B27/34B32B27/36B32B27/365B32B2457/00B32B2250/24B32B2250/40B32B2307/302B32B2262/106B32B2262/101B32B2307/72B32B2307/732B32B7/02B32B2262/10B32B1/00B29C45/14508B29K2069/00B29K2309/08B29K2713/00B29L2031/3481B32B5/024B32B27/12B32B2250/03B32B2260/023B32B2260/046B32B2262/14G06F1/1633
Inventor 斯科特·迈克尔·戴维斯丹尼尔·索尔克雷格·劳伦斯·米尔恩克里斯托弗·沃尔埃米莉·霍姆西
Owner SABIC GLOBAL TECH BV