A chip nano-silver paste coating device
A nano-silver paste and coating device technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid devices, etc., can solve problems such as low coating efficiency, affecting chip production efficiency, and inability to meet different types of chips, and achieve coating High efficiency, easy to replace, and avoid displacement
Active Publication Date: 2021-06-04
HIDETAKA NANO TECH CO LTD
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- Application Information
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Problems solved by technology
Nano-silver is usually attached to the chip by coating, but the existing mechanical coating method has the following problems: first, it cannot meet different types and sizes of chips; second, the coating efficiency is low, which affects the production efficiency of the chip
Method used
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Embodiment Construction
[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0027] A chip nano-silver paste coating device, including a bottom plate 1, an auxiliary part 7, a first motor 15, a second motor 42, and a limiting part 32;
[0028] The bottom plate 1 is provided with a first supporting column 2, a second supporting column 3, a third supporting column 4, and a fourth supporting column 5, and the first supporting column 2, the second supporting column 3, the third supporting column 4, and the fourth supporting column The columns 5 are distributed clockwise around the central axis of the base plate 1, the first support column 2 and the third support column 4 are distributed diagonally, the second support column 3 and the fourth support column 5 are distributed diagonally; the base plate 1 is provided with a For the track 6, the track 6 is located outside the first support column 2 and the second support column ...
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Abstract
The invention provides a chip nano-silver paste coating device, which solves the problems that the existing chip coating device has low coating efficiency and cannot meet different types of chips; through the driving wheel, the driven wheel, the first motor, the first Cables, second cables, etc. drive the first roller and the second roller to rotate, and the auxiliary plate moves along the X direction on the track, thereby driving the coating wheel to complete the coating of multiple chips. The coating efficiency is high, and multiple groups can be carried out at the same time. The coating operation of the chip greatly improves the production efficiency of the chip; the detachable installation of the auxiliary shaft is realized through the first installation shaft and the second installation shaft, which facilitates the replacement of coating wheels of different widths and satisfies the needs of coating of different types and sizes of chips. Coating, high flexibility, strong versatility; use the limit piece to realize the axial positioning of the coating wheel, to avoid the coating wheel from shifting during the coating process and affect the coating operation.
Description
technical field [0001] The invention relates to the technical field of coating devices, in particular to a chip nano-silver paste coating device. Background technique [0002] The promotion of modern science and technology by nanotechnology has shown great results. In the field of semiconductor manufacturing, nanotechnology has allowed Moore's Law to continue. Material science experiments have proved that when the material particles reach the nanoscale, the material has high surface activity and surface performance. This makes the melting point or sintering temperature of nanoparticles much lower than that of bulk materials, but the materials formed after sintering have similar melting points and properties to bulk materials, which makes them have broad application prospects in the field of microsystem integration. . Silver metal is particularly suitable as an assembly material for high-power products, making nano-silver a popular packaging material among numerous nanomat...
Claims
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IPC IPC(8): H01L21/67
Inventor 崔建中
Owner HIDETAKA NANO TECH CO LTD