Rapid cooling plastic material extrusion mold of backflow ejector pin wiping glue layer

Abstract

The invention discloses a rapid cooling plastic material extrusion mold of a backflow ejector pin wiping glue layer. The mold structurally comprises a control machine, a forming chamber, and a bottombox; the control machine is arranged on the forming chamber and is electrically connected with the forming chamber, the forming chamber is locked with the bottom box, the forming chamber is composed of a forming frame, a forming inner frame, a backflow chamber and an ejector pin structure. The forming frame is locked with the forming inner frame, the forming inner frame is engaged with the backflow pipe, the ejector pin structure is arranged on the forming frame and the forming inner frame, during machining, a semi-formed mold enters from the left end of the forming chamber, the formed mold isout of the right end, an upper ejector pin and a lower ejector pin achieve wiping of glue scales on the left side face of the forming frame, the glue scales on the lower surface of a left mold frameis wiped by a right bottom mold frame, in the wiping process, an air ring machine blows off part of glue scale, the cleaning effect of the wiping glue layer is improved in an assisting manner, meanwhile, the wiping layer forms the cluster shape, the friction force is increased, and the thick scale layer is cleared.

Description

technical field [0001] The invention relates to the field of moulds, in particular to a rapidly cooling plastic profile extrusion die for reflowing ejector pins to wipe the glue layer. Background technique [0002] During processing, powdery or granular polymers are usually added to the barrel of the extruder, and under the action of the screw or plunger, the polymer moves forward along the trough, and forms a gap with the mold under the action of the mold. The continuum with similar die shape can be formed into products of the desired shape after cooling and shaping, such as various plastic pipes, rods, sheets, plastic steel doors and windows, films, decorative skirting boards, etc. [0003] In the prior art, when processing the semi-formed mold body on the molding chamber, the glue will stick to the molding chamber, and the glue on the inside of the molding chamber cannot be cleaned up manually. If the glue is not cleaned in time, the glue will accumulate over time. The s...

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Problems solved by technology

[0004] The main purpose of the present invention is to overcome the deficiencies of the prior art, to provide a rapid cooling plastic profile extrusion die for reflowing the thimble to wipe the rubber layer, so as to solve the problem that the semi-formed mold body will be molded in the molding chamber during processing. The glue sticks to

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