Electroplating solution preparing device
A technology of electroplating solution and control device, which is applied to mixers with rotary stirring devices, transportation and packaging, dissolving and other directions, can solve the problems of increasing mixing time, slow pouring speed of electroplating solution, inability to mix uniformly, etc. Achieve the effect of improving work efficiency, saving mixing time and ensuring stability
Inactive Publication Date: 2019-07-09
嘉兴宜鸿贸易有限公司
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Problems solved by technology
[0002] In the production process of the electroplating solution, firstly, different ingredients need to be stirred and mixed, and the mixed electroplating solution is poured out to facilitate subsequent processing. The existing mixing devices often have poor mixing effects and cannot mix uniformly. The mixing effect is too poor, which increases the mixing time, slows down the pouring speed of the electroplating solution, reduces the overall efficiency of production work, and thus cannot meet the higher production demand of the electroplating solution
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[0013] Combine below Figure 1-3 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.
[0014] refer to Figure 1-3 According to an embodiment of the present invention, an electroplating solution preparation device includes a device main body 11, a stirring device is provided inside the device main body 11, a lifting device is provided outside the device main body 11, and a lifting device is provided on the lower side of the stirring device. There is a control device, the stirring device includes a stirring chamber 12 which is arranged in the main body 11 of the device and has an upward opening, a stirring rod 13 is arranged in the stirring chamber 12, and a flip plate 14 is arranged on the upper side of the stirring chamber 12, The rear side of the stirring chamber 12 is...
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The invention discloses an electroplating solution preparing device. The electroplating solution preparing device comprises a device main body, wherein a stirring device is arranged in the device mainbody, a hoisting device is arranged at the outer side of the device main body, a control device is arranged at the lower side of the stirring device, the stirring device comprises a stirring chamber,which is arranged in the device main body and has an upward opening, a stirring rod is arranged in the stirring chamber, a flipping plate is arranged at the upper side of the stirring chamber, and asealing plate is arranged at the rear side of the stirring chamber. When raw materials of an electroplating solution are added into the stirring chamber, the flipping plate is opened firstly, then, the flipping plate is closed, the stirring rod is used for carrying out stirring, and then, the sealing plate is opened to discharge the stirred electroplating solution; and when the electroplating solution is hoisted through the device, the electroplating solution can be stirred during upward hoisting, the time of stirring before hoisting can be saved, the working efficiency is increased greatly, meanwhile, the stability of the device during hoisting is guaranteed through two ways, the safety is improved greatly, and thus, the electroplating solution preparing device is more reliable.
Description
technical field [0001] The invention relates to the technical field of mixing modulation, in particular to an electroplating solution modulation device. Background technique [0002] In the production process of the electroplating solution, it is first necessary to stir and mix different ingredients, and pour out the mixed electroplating solution to facilitate subsequent processing. The existing mixing devices often have poor mixing effects and cannot mix uniformly. If the mixing effect is too poor, the mixing time will be increased, and the pouring speed of the electroplating solution will be slow, which will reduce the overall efficiency of production work, and thus cannot meet the higher production demand of the electroplating solution. Contents of the invention [0003] The object of the present invention is to provide an electroplating solution modulation device for overcoming the above-mentioned defects in the prior art. [0004] An electroplating solution preparati...
Claims
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Login to View More IPC IPC(8): B01F7/18B01F15/02B01F15/00
CPCB01F27/808B01F27/90B01F35/451B01F35/75
Inventor 段春光
Owner 嘉兴宜鸿贸易有限公司