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Fabrication process of a vertically interconnected radio frequency cube structure

A manufacturing process and cube technology, which is applied in the field of radio frequency cube structure manufacturing technology, can solve the problems of increasing module cost, module fragmentation, cracking, etc.

Active Publication Date: 2021-04-09
浙江集迈科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for higher-density TSV adapter boards, if the number of stacked layers is large and the stress is too large, it will often cause the entire module to break or interlayer cracks, and the multi-layer TSV structure will greatly increase the entire module. cost

Method used

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  • Fabrication process of a vertically interconnected radio frequency cube structure
  • Fabrication process of a vertically interconnected radio frequency cube structure
  • Fabrication process of a vertically interconnected radio frequency cube structure

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] A manufacturing process of a vertically interconnected radio frequency cube structure provided by an embodiment of the present invention specifically includes the following steps:

[0034] A: Make a groove on the surface of the RF chip adapter board, and fill the groove with metal; open a cavity on the front of the adapter board, and embed the RF chip;

[0035] Such as Figure 1a As shown, a groove 103 is formed on the surface of the radio ...

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Abstract

The invention discloses a manufacturing process of a vertically interconnected radio frequency cube structure, comprising the following steps: making a groove on the surface of a radio frequency chip adapter plate, filling the groove with metal; opening a cavity on the front of the adapter plate, and embedding a radio frequency chip ; Make RDL and pads on one side of the RF chip, thin the back of the adapter board, and make pads on the back; weld the RF chip adapter boards together through wafer-level bonding; mechanically cut to obtain a single cube; paste on the cube Install the antenna, paste the interconnection adapter board and the power driver chip on the side of the cube to complete the electrical interconnection of the cube to obtain the final functional radio frequency cube.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a manufacturing process of a vertically interconnected radio frequency cube structure. Background technique [0002] For high-frequency microsystems, the area of ​​the antenna array is getting smaller and smaller, and the distance between the antennas must be kept within a certain range so that the entire module can have excellent communication capabilities. However, for analog device chips such as radio frequency chips, the area cannot be reduced exponentially like digital chips. In this way, there will be no enough area for ultra-high frequency radio frequency microsystems to place PA / LNA at the same time. LNAs are stacked. [0003] For stacked modules, it is necessary to connect the upper chip to the lower layer through TSV interconnection, and finally interconnect with the substrate to realize the output of the function. However, for higher-density TSV ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/60H01L23/66
CPCH01L21/4817H01L23/66H01L24/03H01L24/82H01L2223/6677H01L2224/0231H01L2224/82007H01L2224/13025H01L2224/16227
Inventor 冯光建
Owner 浙江集迈科微电子有限公司