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Packaging structure of conductive module

A technology of packaging structure and conductive module, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as restricting DBC ceramic substrates, and achieve the effect of small stray capacitance and stray inductance

Pending Publication Date: 2021-12-07
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, higher stray parameters restrict the application of DBC ceramic substrates in the high frequency field

Method used

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  • Packaging structure of conductive module
  • Packaging structure of conductive module
  • Packaging structure of conductive module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Specifically, such as figure 1 and figure 2 As shown, in the first embodiment of the present invention, the module circuit 20 includes a chip conductive layer 22 , a chipset 24 , an interconnect conductive layer 26 and an upper surface pad component 28 . Wherein, the chip conductive layer 22 is disposed on the upper surface 12 of the substrate 10 . The chip set 24 has a top port 242 and a bottom port 244 , the chip set 24 is disposed on the chip conductive layer 22 , and the bottom port 244 is connected to the chip conductive layer 22 . The interconnect conductive layer 26 is connected to the chip conductive layer 22 and the side conductive layer 40 . The upper surface pad assembly 28 is connected to the top port 242 , and the upper surface pad assembly 28 is spaced apart from the conductive layer 22 of the chip.

[0051] In the above arrangement, a conduction path is formed between the chip conductive layer 22, the chipset 24, the interconnection conductive layer 2...

Embodiment 2

[0073] Such as image 3 and Figure 4 As shown, in Embodiment 2 of the present invention, the packaging structure of the conductive module includes two module circuits 20, and the two module circuits 20 are arranged at intervals in the length direction of the substrate 10, and the first upper surface of one module circuit 20 is welded. The pad 282 is connected and conducted with the chip conductive layer 22 of another module circuit 20 .

[0074] In the above arrangement, the processing function of the external electrical signal is realized through two sets of chipsets 24, which makes the processing capability of the packaging structure stronger, thereby meeting the functional requirements of the packaging structure.

[0075] Embodiment 2 is the same as Embodiment 1 in other structures, and will not be repeated here.

[0076] It should be noted that the module circuit 20 in the present invention can flexibly set soldering areas, conductive layers and pad components on the up...

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Abstract

The invention provides a packaging structure of a conductive module. The packaging structure of the conductive module comprises: a substrate which is provided with an upper surface and a lower surface opposite to the upper surface, wherein the substrate also comprises a side surface; a module circuit disposed on the upper surface; a lower surface pad assembly disposed on the lower surface; and a side face conducting layer arranged on the side face, wherein the side face conducting layer is connected with the module circuit and the lower surface bonding pad assembly, and the module circuit is conducted with the lower surface bonding pad assembly through the side face conducting layer. According to the packaging structure, a conducting layer and related components arranged on the lower surface are omitted, so that the problem that large stray capacitance exists between conductors due to the fact that conducting layers and related components are arranged on the upper surface and the lower surface of the DBC ceramic substrate is solved, therefore, the packaging structure has the advantages that the generated stray capacitance is small, and the packaging structure can be applied to the high-frequency field. The stray inductance and the parasitic inductance of the packaging structure of the conductive module are reduced.

Description

technical field [0001] The present invention relates to the technical field of packaging of conductive modules, in particular to a packaging structure of conductive modules. Background technique [0002] At present, power semiconductor devices are the core of power electronics technology and are widely used in electric vehicles, power electronic devices, photovoltaic inverters, microwaves and switching power supplies. With the continuous improvement of switching frequency and power density requirements, power semiconductor devices are gradually developing towards high switching frequency, miniaturization, high integration, and high power density, especially those composed of multiple insulated gate bipolar transistors and FWD diodes. High-power modules are the main development trend of the industry. There will be many stray parameters between the internal structures of the modules, and the existence of these stray parameters will affect the safe operation of the control cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/498
CPCH01L23/14H01L23/49838
Inventor 蔡苗贠明辉郑建娜高永杰杨道国位松
Owner GUILIN UNIV OF ELECTRONIC TECH