A multi-layer stacked vertically interconnected radio frequency structure and its manufacturing method

Abstract

The invention discloses a multi-layer stacked vertically interconnected radio frequency structure, which includes an antenna array element, a heat dissipation carrier board, a base carrier board and a radio frequency module. The antenna array element is mounted on the upper surface of the heat dissipation carrier board and the lower surface of the heat dissipation carrier board It is welded with the upper surface of the base carrier plate, and the RF module is mounted on the lower surface of the base carrier plate; wherein, the lower surface of the heat dissipation carrier plate is provided with a flow port horizontally, one side of the flow port extends to the side of the heat dissipation carrier plate, and the heat dissipation carrier plate is vertically arranged with multiple rows Through metal columns, metal columns are set at corresponding positions on the base carrier plate, and through holes are set between the metal columns on the base carrier plate; A radio frequency structure of layer-stacked vertical interconnection and a manufacturing method thereof.

Description

technical field [0001] The invention relates to the technical field of semiconductors, more specifically, it relates to a multi-layer stacked vertically interconnected radio frequency structure and a manufacturing method thereof. Background technique [0002] Microwave and millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weaponry and Internet industry. Millimeter-wave radio frequency integrated circuits also have huge actual needs and potential markets. [0003] However, for high-frequency microsystems, the area of ​​the antenna array is getting smaller and smaller, and the distance between the antennas must be kept within a certain range so that the entire module can have excellent communication capabilities. However, for analog device chips such as radio frequency chips, the area cannot be reduced exponentially like digital chips. In this way, there will be no enough area for ultra-high frequency radio frequency mi...

AI Technical Summary

Problems solved by technology

However, for analog device chips such as radio frequency chips, the area cannot be reduced exponentially like digital chips. In this way, there will be no enough area for ultra-high frequency radio frequency microsystems to place PA / LNA at the same time. LNAs are stacked, so it will become very difficult to dissipate heat from the upper chip based on the heat-conducting copper pillars

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