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A kind of fast curing epoxy resin adhesive and preparation method thereof
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An epoxy resin, rapid curing technology, applied in the preparation of epoxy resin glue, adhesive, sulfide, etc., can solve the problems of poor heat resistance and insufficient strength of epoxy resin, and achieve good heat resistance, good chemical and physical High performance and high bonding strength
Active Publication Date: 2021-04-16
广东蓝天优创美化妆品有限公司
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[0004] Aiming at the problems of insufficient strength and poor heat resistance of epoxy resin cured by mercaptan curing agents in the prior art, the present invention provides an epoxy resin adhesive with high curing strength, good heat resistance and fast curing
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Embodiment 1
[0054]Preparation method of rapid curing epoxy resin adhesive, including the steps of:
[0056]In a three-mouth flask equipped with mechanical stirring, a thermometer, a refluxing condenser, 22.2 g of methacrylate, 50 g of tetra (3-mercaptoacid) pentaerythritol ester, 0.7 g of triethylamine, 60 g of chloroform , Stirring, heat reflux at 65-75 ° C for 20 h, collecting the product decompression distillation to modify terpolycene (three functional);
[0057](2) Preparation of rapid curing epoxy resin adhesive at room temperature
[0058]Preparation of a component: Weigh 80G E-51 epoxy resin
[0059]The preparation of the B component: 20G step (1) obtained by 50 g of step (1), 40 g 2-mercaptopenzimidazole, DMP-3010G, uniform mixing.
Embodiment 2
[0061]Preparation method of rapid curing epoxy resin adhesive, including the steps of:
[0063]In a three-mouth flask equipped with mechanical stirring, a thermometer, a reflux condensed tube, 20.9 g of ineretetrane (IBOA), 50 g of tetra (3-mercaptopropionic acid) pentaerythritol ester, 0.7 g of triethylamine, 60 g of trichloride Methane, stirred, heat reflux for 20 h at 65-75 ° C, and the product was collected and distilled to modify the trioliol;
[0064](2) Preparation of rapid curing epoxy resin adhesive at room temperature
[0065]Preparation of a component: Weigh 80G E-51 epoxy resin
[0066]The preparation of the B component: 20G step (1) obtained by 50 g of step (1), 40 g 2-mercaptopenzimidazole, DMP-3010G, uniform mixing.
Embodiment 3
[0068]Example 1 was repeated, only 22.2 g of methacrylate (IBOMA) was replaced with 17.6 g of methyl methacrylate (BZMA).
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Abstract
The invention provides a fast-curing epoxy resin adhesive and a preparation method thereof. By modifying the polythiol curing agent, using an amine catalyst and selecting a specific acrylate material to react with the polythiol, the thiol Rigid groups such as polycyclic or benzene rings are introduced into the molecular structure of the curing agent, and the compounded imidazoles contain heterocyclic and benzene ring rigid groups. The epoxy resin curing agent made of this new type of curing agent can be used in Fast curing at room temperature, and the cured product has good chemical and physical properties, especially heat resistance and bonding strength.
Description
Technical field[0001]The present invention relates to an epoxy resin adhesive, and more particularly to a rapid curable epoxy resin adhesive and preparation method thereof in a polyfunctional modified polyester canthanol and a preparation method thereof.Background technique[0002]Epoxy resin is a type of thermosetting resin material having good adhesive, high mechanical, chemical, electrically insulating. It has been widely used in a variety of metal non-metallically bonded, chemically corrosive coatings, electrical insulating materials, and the like. It plays an important role in electronics, electrical, mechanical manufacturing, chemical corrosion, aerospace, ship transportation, and many other industrial sectors, has become an indispensable basic material in various industrial sectors.[0003]In an epoxy resin application, the curing agent has a very important position. There are a wide variety of epoxy resin curing agents. At present, the most widely used room temperature curing ag...
Claims
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