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3D NAND Flash

A unique, register group technology, applied in the field of 3D NAND Flash, can solve the problems of large bus consumption and power consumption, and achieve the effect of ensuring accuracy and reducing power consumption

Active Publication Date: 2019-07-23
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a kind of 3D NAND Flash, the purpose is to solve the problem that the power consumption of the bus in 3D NAND Flash is larger

Method used

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0035] figure 1 A schematic diagram of a 3D NAND Flash provided for this application, including MCU, bus, bus control circuit and multiple registers. Wherein, the multiple registers are pre-divided into at least two register groups, so that any register group is connected to the bus control circuit through a part of the bus. For the convenience of description, a part of the bus is called a local bus, that is, any The register group is connected with the bus control circuit through ...

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Abstract

The invention discloses a 3D NAND Flash. The 3D NAND Flash comprises an MCU, a bus control circuit, a bus and a plurality of registers. The plurality of registers are divided into at least two register groups in advance. Any one register block has a preset unique group address field, and any one register has a preset unique local addressing address field in the register block to which the registerbelongs. Any one register block is connected with the bus control circuit through a local bus. The bus control circuit is connected with the MCU. The MCU is used for sending a first signal to the buscontrol circuit. The first signal comprises an address of at least one register; a bus control circuit used for sending a second signal to a register in the register group indicated by the group address field in the first signal after receiving the first signal; a register in the register bank indicated by the group address field in the first signal is used for responding to the received second signal. Through the technical scheme disclosed by the invention, the power consumption of the bus can be reduced.

Description

technical field [0001] This application relates to the field of electronic information, in particular to a 3D NAND Flash. Background technique [0002] Flash is a non-volatile flash memory. Among them, 3D NAND Flash (three-dimensional NAND flash memory) is a kind of non-volatile flash memory. [0003] Currently, 3D NAND Flash includes a Microcontroller Unit (MCU), a bus, and multiple registers, wherein the MCU communicates with the registers through the bus so that the registers can store data specified by the MCU. [0004] However, the power consumption of the bus in 3D NAND Flash is relatively large. Contents of the invention [0005] The present application provides a 3D NAND Flash, aiming at solving the problem of high power consumption of the bus in the 3D NAND Flash. [0006] In order to achieve the above object, the application provides the following technical solutions: [0007] This application provides a 3D NAND Flash, including: MCU, bus control circuit, bus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F12/02
CPCG06F12/0246Y02D10/00
Inventor 高帅侯旭王颀霍宗亮叶甜春
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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