Localized channel field effect transistor and preparation method thereof

A field effect transistor and localization technology, which is applied in the field of preparation of the field effect transistor to achieve the effects of reducing the minimum noise figure, improving the gain and linearity, and increasing the equivalent conductive cross-sectional area

Active Publication Date: 2019-08-06
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is no method to improve the linearity and gain of field effe

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  • Localized channel field effect transistor and preparation method thereof
  • Localized channel field effect transistor and preparation method thereof
  • Localized channel field effect transistor and preparation method thereof

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[0019] The technical solutions of the present invention will be described in further detail below with reference to the embodiments and the accompanying drawings.

[0020] In this embodiment, the field effect transistor is a GaN high electron mobility transistor (HEMT), and the GaN HEMT structure with localized channel structure is shown in FIG. 1 , wherein FIG. 1( a ) is a top view of the device structure, and FIG. ) is a cross-sectional view of the device structure; 101 is the source, 102 is the drain, 103 is the gate, 104 is the channel well, the channel well 104 is filled with a medium and covered by the gate metal, 105 is an AlGaN barrier layer, 106 It is a GaN channel and a buffer layer, and the substrate layer is not drawn in the figure; the localized channel FET structure proposed by the present invention is not limited to GaN HEMT, and can also be based on semiconductor materials such as Si and GaAs; The channel structure GaN HEMT significantly increases the ratio of ...

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Abstract

The invention discloses a localized channel field effect transistor and a preparation method thereof. The transistor comprises a source, a drain, and a gate between the source and the drain. Channel wells having a certain duty ratio are etched in a channel region covered by a gate pin, are filled with a dielectric, are arranged along the direction in which the channel extends at equal intervals, and have a radial width smaller than a gate length. The preparation method comprises the steps of: (1) preparing a source and a drain; (2) eliminating the conductivity outside an active region and forming the channel wells in the channel region; (3) growing dielectrics on the surface of a device, etching the dielectrics in the gate pin and outside the channel wells by an etching process; and (4) preparing the gate. The method can increase the equivalent conductive cross-sectional area outside the channel of the field effect transistor, reduces a field effect transistor source and drain resistance, alleviates the restriction of the limited conductivity outside the channel on the channel current under a large forward gate bias, improves the gain and linearity of the RF amplification field effect transistor, and reduces the minimum noise factor.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to a field effect transistor with a localized channel, and also relates to a preparation method of the field effect transistor. Background technique [0002] RF amplifier circuits based on Si, GaAs, and GaN field effect transistors have important applications in a wide range of fields such as communications, navigation, identification, measurement and control, radio and television, remote sensing and telemetry, radio astronomy, early warning detection, precision tracking, electronic countermeasures, and fire control guidance. . In related applications such as 5G communication, millimeter wave amplification, etc., higher requirements are placed on the linearity and gain characteristics of the device; [0003] At present, the technologies for improving the linearity of field effect transistor radio frequency amplification mainly include analog predistortion, digital predistortion, new circui...

Claims

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Application Information

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IPC IPC(8): H01L29/778H01L29/10H01L21/335
CPCH01L29/7786H01L29/1029H01L29/66462
Inventor 韩克锋
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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