Cooling fin structure and manufacturing method thereof
A manufacturing method and heat sink technology, applied in cooling/ventilation/heating transformation, modification through conduction heat transfer, etc., can solve the problems of low heat dissipation efficiency and large heat sink volume, and achieve increased heat radiation efficiency and excellent heat dissipation efficiency Effect
Inactive Publication Date: 2019-08-06
阙山腾
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Problems solved by technology
[0004] The object of the present invention is to provide a heat sink structure and its manufacturing method to solve the defects of large heat sink volume and low heat dissipation efficiency in the prior art
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[0031] The detailed description and technical content of the present invention will be described as follows with the accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present invention.
[0032] Please refer to Figure 1 to Figure 2 As shown, the present invention provides a heat sink structure and a manufacturing method thereof, the steps of which are described in detail as follows.
[0033] Such as figure 1 Steps a~c of and figure 2 As shown, a substrate 1 and a graphene layer 3 are provided in step a, the substrate 1 has a heat dissipation surface 11, and the graphene layer 3 can be coated on the heat dissipation surface 11 by spraying or chemical vapor deposition, so that the graphene layer 3 Can be firmly combined on the substrate; in step b, a ceramic powder with far-infrared radiation ability is provided, and the surface modification operation is performed on the ceramic powder, and the surface modif...
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Abstract
The invention relates to a cooling fin structure and a manufacturing method thereof. The cooling fin structure comprises a substrate, a ceramic powder layer and a graphene layer. The substrate has a heat dissipating surface and a heat absorbing surface. The ceramic powder layer is stacked on the heat dissipating surface. The ceramic powder layer is composed of ceramic powders having a capability of converting heat into light, and has a thickness less than 100[mu]m. The graphene layer is stacked between the heat dissipating surface and the ceramic powder layer or coats the heat absorbing surface. The graphene layer is made of a graphene material. Therefore, by means of the capability of the ceramic powder layer for converting heat into light, the graphene layer can quickly and uniformly transfer the heat to the entire heat dissipating surface to increase the heat radiation efficiency of the entire heat dissipating surface of the ceramic powder layer. Thus, the cooling fin structure of the invention has high heat dissipation efficiency than a conventional cooling fin.
Description
technical field [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation fin structure and a manufacturing method thereof. Background technique [0002] In order to stabilize the operation of the electronic components, a heat sink is usually attached to the electronic components, and the heat of the electronic components is convected to the atmosphere through the heat sink. Among them, traditional heat sinks are made of high-conductivity materials such as copper and aluminum, and then efficiently transfer heat to atmospheric convection in a high-conductivity heat conduction manner. [0003] However, with the diversification of functions and extreme performance requirements of modern electronic products, heat sinks made of common high-conductivity metals such as copper and aluminum are no longer able to achieve energy-saving, space-saving, and high-quality products for the new generation of electronic components. Short, high heat diss...
Claims
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Login to View More IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 阙山腾
Owner 阙山腾