Heat dissipation assembly

Abstract

Disclosed is a heat dissipation assembly. The heat dissipation assembly comprises a fun, a heat dissipation fin, a heat conduction structure and a dead wall structure. The heat conduction structure is composed of heat conductivity materials, and is provided with a first heat conduction part and two second heat conduction parts. The first heat conduction part contacts a heating element. The two heat conduction parts contact the heat dissipation fin. Heat energy of the heating element is conducted to the first heat conduction part, then is respectively conducted to the two second heat conduction parts, and then is conducted to the heat dissipation fin through the two second heat conduction parts. After being blown out of the fun, cooling air is first blown to the heating element, then turns and is be blown to an air inlet surface of the heat dissipation fin through guide of the dead wall structure, then is blown outside the heat dissipation fin from an air outlet surface of the heat dissipation fin, and then is discharged outside a shell through an air outlet.

Description

technical field [0001] The invention relates to a heat dissipation component, especially a special design of heat conduction structure, which transfers the heat energy generated by the heating element to the heat dissipation fins in a "Y" shape, which can shorten the heat dissipation between the heat dissipation element and the heat dissipation fins. By shortening the distance between the cooling fins and the fan, the heat energy generated by the heating element can be quickly and evenly transferred to the cooling fins, thereby improving the performance of the overall cooling component and reducing the space occupied by the cooling component. Background technique [0002] The structure of the existing heat dissipation assembly installed in the housing of the electronic device mainly includes a fan and a heat dissipation fin. The heat dissipation fin is arranged at the air outlet end of the fan and is in contact with the fan, and the heat dissipation fin is in contact with the...

AI Technical Summary

Problems solved by technology

[0006] Because the fan 11 and the heat dissipation fins 12 are separately arranged in the above-mentioned existing heat dissipation assembly 10, and the heating element 14 is arranged between the fan 11 and the heat dissipation fins 12, the distance between the fan 11 and the heat dissipation fins 12 is very long, and the cooling wind first Blowing to the heating element 14 and then reaching the cooling fins 12, when the cooling air reaches the cooling fins 12, the speed of the cooling air has been greatly reduced, thus affecting the heat dissipation performance of the cooling fins 12, making it impossible to effectively dissipate heat

In addition, due to the long distance between the fan 11 and the heat dissipation fins 12 of the existing heat dissipation assembly 10, it must occupy a large space, which is not conducive to the miniaturization of electronic devices.

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