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Probes for test setups of electronic devices with enhanced filtering properties

A filter capacitor and probe technology, which is applied in the field of probes, can solve the problems of reduced filter capacity and increased interface board thickness, etc.

Active Publication Date: 2022-07-01
TECHNOPROBE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All this leads to the need to realize an interface board 4 with a large number of layers, increasing the thickness of the interface board, so that the filter capacitor 9 arranged on the tester side moves itself away from the corresponding power and ground probes 2, in particular away from their contact tips 2A , and lead to a corresponding reduction in filtering capability
[0024] Therefore, even the latest solution of placing the tester-side filter capacitor 9 in the area Aph corresponding to the probe 1 has to deal with conflicting requirements and can only obtain a compromise in terms of its performance improvement

Method used

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  • Probes for test setups of electronic devices with enhanced filtering properties
  • Probes for test setups of electronic devices with enhanced filtering properties
  • Probes for test setups of electronic devices with enhanced filtering properties

Examples

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Embodiment Construction

[0066] With reference to these drawings, in particular Figure 2A , a probe having a plurality of contact probes for testing electronic devices, especially electronic devices integrated on a wafer, is generally indicated at 20 .

[0067] It should be noted that the drawings represent schematic representations of probes according to the present invention and are not drawn to scale, but they are drawn to emphasize important features of the present invention.

[0068] Furthermore, it is obvious that different aspects of the invention, which are represented by the examples in the drawings, can be combined with each other and interchanged between embodiments.

[0069] In particular, as Figure 2A As shown, the probe 20 includes a plurality of vertical-type contact probes 21 that are slidably accommodated in a support 22, which is substantially a plate-like card. More specifically, Figure 2A The probe 20 shown in includes at least a first set of contact probes for delivering power ...

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PUM

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Abstract

The application describes a probe (20) comprising a plurality of contact probes (21A, 21B, 21C) slidably received in a corresponding plurality of guide holes (25A, 27A, 29A) , 36A; 25B, 27B, 29B, 36B; 28C, 29C, 36C), the plurality of guide holes are implemented in the plate-like support (22), and the plurality of contact probes (21A, 21B, 21C) include At least a first set of contact probes (21A, 21B) carrying ground and power signals (GND, PWR). Suitably, the probe (20) comprises at least one filter capacitor (30) having at least one electrode (31) electrically connected to a conductive part (22A, 27A) at the support (22) At least one housing guide hole (25A, 29A) of the first set of contact probes (21A, 21B) is realized thereon.

Description

technical field [0001] The present invention relates to a probe for a testing device of an electronic device. [0002] The present invention relates particularly, but not exclusively, to probes with enhanced frequency performance, and the following description is made with reference to this field of application for the sole purpose of simplifying its description. Background technique [0003] As is known, a probe is essentially a device suitable for placing a plurality of contact pads of a microstructure (especially an electronic device integrated on a wafer), and a test to perform its working test (especially an electrical test, or a test in general) The corresponding channels of the device are in electrical contact. [0004] Tests performed on integrated devices are particularly useful for detecting and isolating defective devices already in manufacturing steps. Typically, probes are therefore used to electrically test devices integrated on a wafer prior to dicing or sin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/073G01R1/067G01R1/18
CPCG01R1/073G01R1/067G01R1/18G01R1/06772G01R1/07357G01R1/07371G01R31/2886G01R1/07364G01R1/07392G01R3/00G01R31/31905
Inventor 弗拉维奥·马焦尼
Owner TECHNOPROBE