Production process for preventing dysfunction of microphone

Abstract

The invention relates to the technical field of flexible circuit boards, and more particularly to a production process for preventing the dysfunction of a microphone. In a process of assembling a printed circuit board, more than two non-closed annular structures are used for the solder paste soldering of microphone components. The non-closed annular structures have the same center and different radii. The radius extension lines, where the disconnected portions of every two adjacent non-closed annular structures are located, do not coincide with each other. The production process for preventingthe dysfunction of a microphone solders the microphone components by using the non-closed annular structures during the process of assembling the printed circuit board. Since the disconnected portions of the non-closed annular structures are staggered, the non-closed annular structures in respective layers can complement each other to form a closed loop when the microphone components are soldered, thereby avoiding the dysfunction of the microphone component due to the broken loop, improving a phenomenon of sound leakage of the microphone components on the circuit board caused by disconnectedloop in the conventional soldering, and further improving the stability of an electronic product.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, and more particularly, relates to a production process for preventing malfunction of a microphone. Background technique [0002] Microphone components, hereinafter referred to as MIC components, are commonly used components in communication products, and are assembled using the Surface Mount Technology (hereinafter referred to as SMT) process. In the SMT process, there are often malfunctions caused by the limitations of the SMT process. Since the normal printing stencil cannot make a closed circle, unless additional tin is added in the disconnected area, but the cost is very high, therefore, the solder paste printing must be composed of at least two disconnected semi-circles, so the printed Solder paste cannot form a closed loop, and it is easy to form a broken loop after soldering at and around the broken loop of the solder paste, thereby affecting the function of the MIC compon...

AI Technical Summary

Problems solved by technology

In the SMT process, there are often poor functions due to the limitations of the SMT process

Since the normal printing stencil cannot make a closed circle, unless additional tin is added in the disconnected area, but the cost is very high, therefore, the solder paste printing must be composed of at least two disconnected semi-circles, so the printed Solder paste cannot form a closed loop, and it is easy to form a broken loop after soldering at and around the broken loop of the solder paste, thereby affecting the function of the MIC component

[0003] The malfunction of MIC components caused by the current SMT process has caused the entire SMT industry to invest a lot of expensive testing equipment and manpower for inspection, but the problem of broken rings still flows out to end customers, causing immeasurable losses

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