Die bonding device
A technology of solid crystal and fixed mechanism, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems that LED chips cannot meet the production requirements, improve the efficiency and quality of solid crystal, and avoid the problem of solid crystal unstable effect
Pending Publication Date: 2019-08-20
先进光电器材(深圳)有限公司
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Problems solved by technology
[0003] As the LED chip is getting smaller and smaller, the distance between the die-bonding points is getting closer and closer, the requirements for the die-bonding precision of the equipment are getting higher and higher, and the speed is getting faster and faster. The conventional way of transferring LED chips by suction has far reached less than production requirements
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Embodiment 1
[0042] Please refer to Figure 1 to Figure 5 , Embodiment 1 of the present invention is:
[0043] A crystal-bonding device, such as figure 1 and figure 2 As shown, it includes a frame 1, a first fixing mechanism 2 for fixing the crystal ring assembly and a second fixing mechanism 3 for fixing the bracket, and the first fixing mechanism 2 and the second fixing mechanism 3 are respectively fixedly arranged on the On the rack 1, the bracket of this embodiment is the PCB board. The crystal bonding device also includes a visual inspection mechanism 4 for positioning the LED chip, a ejection mechanism 5 for ejecting the LED chip, a first driving mechanism for driving the movement of the first fixing mechanism 2, and a first driving mechanism for driving the ejection mechanism. The second drive mechanism for the movement of the mechanism 5, the visual detection mechanism 4, the ejection mechanism 5, the first drive mechanism and the second drive mechanism are also fixedly arranged ...
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The invention discloses a die bonding device. The device comprises a rack, a first fixing mechanism used for fixing a crystal ring assembly, and a second fixing mechanism used for fixing a support. The first fixing mechanism and the second fixing mechanism are fixedly arranged on the rack. The device also comprises a visual detection mechanism which is used for positioning an LED chip; an ejectionmechanism which is used for ejecting the LED chip; a first driving mechanism which is used for driving the first fixing mechanism to move; a second driving mechanism which is used for driving the ejection mechanism to move. A crystal ring assembly on the first fixing mechanism is located above a support on the second fixing mechanism; the ejection mechanism comprises an ejection piece, and the ejection piece is located above the crystal ring assembly. In the whole die bonding process, the support does not need to move, and the LED chip does not need to be taken out for transferring, so that the die bonding efficiency and the die bonding quality can be greatly improved; and the operation of a small-size LED chip can be met, and the situation that the suction nozzle hole is too small, so that die bonding is unstable or the suction nozzle hole is too large to make contact with the adjacent LED chip subjected to die bonding can be avoided.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging equipment, in particular to a crystal bonding device. Background technique [0002] The crystal-bonding device is the key equipment in the LED back-end packaging production line. The crystal-bonding process is as follows: the dispensing mechanism first dispenses glue at the crystal-bonding station of the bracket, and the single thimble is aimed at the center of the LED chip, and the thimble pins the LED chip on the blue film. Lifting up, the die-bonding arm takes out the LED chip from the crystal ring blue film, rotates it 90°, and then transfers it to the die-bonding station where the glue has been dispensed to complete the die-bonding. [0003] As the LED chip is getting smaller and smaller, the distance between the die-bonding points is getting closer and closer, the requirements for the die-bonding precision of the equipment are getting higher and higher, and the speed is getti...
Claims
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IPC IPC(8): H01L21/68H01L33/48
CPCH01L21/68H01L33/48H01L2933/0033
Inventor 张跃春梁国康梁国城李金龙罗宇
Owner 先进光电器材(深圳)有限公司