Cooling components and electronic equipment

Abstract

An embodiment of the present application provides a heat dissipation assembly, including a pipe body, a first flat connection part, a second flat connection part, a liquid-absorbing core, and a working medium. The pipe body has a first end and a second end opposite to each other. A flat connecting part is connected to the first end of the tube body, a second flat connecting part is connected to the second end, the tube body, the first flat connecting part and the second flat connecting part enclose a medium cavity, and the liquid-absorbing core is arranged on the In the medium cavity, the working medium is encapsulated in the medium cavity. By providing the first flat connection part and the second flat connection part, the frame of the electronic device can be directly connected through the first flat connection part and the second flat connection part, thereby reducing the contact between the heat dissipation component and the housing of the electronic device The area reduces the thermal resistance and facilitates heat dissipation. In addition, the first flat connection part and the second flat connection part are connected to the middle frame of the electronic device, which is beneficial to the light and thin design of the product. In addition, an electronic device including the above heat dissipation component is also provided.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to a heat dissipation component and electronic equipment. Background technique [0002] With the continuous development of electronic equipment, the heat generated due to the high integration and high performance of the internal components of the electronic equipment has been increasing in recent years. In addition, due to the increase in heat generation density due to the advancement of product miniaturization, countermeasures against heat dissipation are becoming more and more important. Heat pipes are widely used in the heat dissipation of electronic devices. Due to the structural limitations of heat pipes, the heat dissipation efficiency of electronic devices is not high, and it is not conducive to reducing the thickness of electronic devices. Contents of the invention [0003] In view of the above problems, the purpose of the present application is to provide a ...

AI Technical Summary

Problems solved by technology

Heat pipes are widely used in the heat dissipation of electronic equipment. Due to the structural limitations of heat pipes, the heat dissipation efficiency of electronic equipment is not high, and it is not conducive to thinning the thickness of electronic equipment.

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