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Etching method and system

An etching system and etching machine technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of product qualification rate reduction, charring and carbonization, affecting product appearance and performance, etc.

Inactive Publication Date: 2019-08-30
CHINA ZHENHUA GRP YUNKE ELECTRONICS +1
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0002] At present, the substrate needs to be pasted on the water-cooled workpiece table with an angle of minus 30 degrees during etching. It is found in production that when the cavity is opened after etching, the substrate will be lifted from the workpiece table, and the front and back will be charred and carbonized. Seriously affect the appearance and performance of the product, resulting in a lower product qualification rate

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Embodiment Construction

[0028] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. The components of the embodiments of the present invention generally described and illustrated in the drawings herein may be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ...

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Abstract

The invention provides an etching method and system, which relates to the technical field of electronic product processing. The etching method, which is used in dry etching of a substrate, includes the steps of putting one side of a silica gel pad close to one side of the substrate, putting the other side of the silica gel pad close to a heat dissipation component and etching the substrate. The silica gel pad is attached to the substrate to ensure that the substrate and the heat dissipation component are close to each other, so that uneven heat dissipation of the substrate during etching is avoided, and the rate of good products and the production efficiency are improved.

Description

Technical field [0001] The invention relates to the technical field of electronic product processing, and in particular to an etching method and system. Background technique [0002] At present, the substrate needs to be pasted on a water-cooled workpiece table with an angle of minus 30 degrees during etching. In production, it is found that after the cavity is opened after etching, the substrate will lift up from the workpiece table, and the front and back sides will be charred and carbonized. Seriously affect the appearance and performance of the product, resulting in a decrease in the product qualification rate. [0003] Therefore, the development of an etching method that can effectively solve the above problems is a technical problem that needs to be solved urgently. Summary of the invention [0004] The purpose of the present invention is to provide an etching method to effectively cool the etched substrate and avoid carbonization of the substrate due to delayed heat dissipat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68345
Inventor 陈天磊史书刚韩玉成彭昌文黄钰洁方亮朱威禹廖东
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS