Liquid cooling plate and power module

Abstract

The invention discloses a liquid cooling plate and a power module, the liquid cooling plate comprises a heat dissipation module, the heat dissipation module comprises heat conduction fins, a heat conduction flow channel is formed between every two adjacent heat conduction fins, and the area of a heat conduction surface, directly facing a heating device, of each heat conduction flow channel is gradually increased in the flowing direction of cooling liquid. In the liquid cooling plate provided by the invention, as the area of the heat conduction surface, directly facing the heating device, of the heat conduction flow channel is gradually increased along the flowing direction of the cooling liquid, although the temperature of the cooling liquid in the heat conduction flow channel is gradually increased along the flowing direction, the heat conduction surface of the heat conduction flow channel is increased, namely, the heat exchange area is increased; and therefore, the heat dissipation uniformity of the liquid cooling plate is improved.

Description

technical field [0001] The invention relates to the technical field of device heat dissipation, in particular to a liquid cold plate. The present invention also relates to a power module comprising the above-mentioned liquid cooling plate. Background technique [0002] With the widespread use of electrical structures, such as the continuous improvement of the power level of converters, the heat transfer equipment liquid cooling plate used for cooling power modules such as IGBTs has higher and higher heat dissipation requirements. [0003] With the increase in the number of power modules such as IGBTs connected in parallel, due to the single inlet and outlet requirements of the liquid cooling plate, and the increase in the number of power modules such as IGBTs connected in parallel on the liquid cooling plate, the flow channel lengthens and the water temperature in the flow channel gradually increases. The heat from the power modules decreases, resulting in an increasing tem...

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Problems solved by technology

[0003] With the increase in the number of power modules such as IGBTs connected in parallel, due to the single inlet and outlet requirements of the liquid cooling plate, and the increase in the number of power modules such as IGBTs connected in parallel on the liquid cooling plate, the flow channel lengthens and the water temperature in the flow channel gradually increases. The heat from the power modules is reduced, resulting in an increasing temperature difference between the front and rear power modules or within the same power module, which in turn leads to poor heat dissipation uniformity of the liquid cooling plate

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