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Multi-layer high-density multi-layer buried hole printed board buried hole processing device and method

A high-density, printed board technology, applied in metal processing and other directions, can solve problems such as shock absorption, and achieve the effects of avoiding punching deviation, convenient position adjustment, and convenient alignment punching

Active Publication Date: 2019-09-03
ZHEJIANG ZAPON ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a multi-layer high-density multi-layer buried-hole printed board buried hole processing device in order to solve the problems of punching positioning, side clamping and maintaining level, and punching shock absorption.

Method used

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  • Multi-layer high-density multi-layer buried hole printed board buried hole processing device and method

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Embodiment Construction

[0028] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0029] Wherein, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings will be omitted, Enlargement or reduction does not represent the size of the actual product; for those skilled in the art, it is understandable that certain known structures and their descriptions in the drawings may be omitted.

[0030] In the drawings of the embodiments of the present invention, the same or similar symbols correspond to the same or similar components; , "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional ...

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Abstract

The invention discloses a multi-layer high-density multi-layer buried hole printed board buried hole processing device. The device comprises a base and vertical rods welded to the four corners of theupper end face of the base, a top plate is attached to the upper end faces of the vertical rods, a middle plate is arranged between the top plate and the base, and a second clamping groove is rotationally connected with a sliding rod. Due to the fact that T-shaped clamping blocks welded to the upper end faces of the vertical rods are in sliding connection with an annular groove, the top plate is rotationally adjusted, the position of a punching needle can be adjusted conveniently, and alignment punching is facilitated; due to the fact that clamping blocks are in sliding connection with the middle plate, the four clamping blocks are kept at the same horizontal plane, the phenomenon that punching is inclined due to the fact that the clamping blocks are inclined is avoided, and meanwhile, dueto the fact that a clamping ring and the base are elastically connected through a first compression spring, the middle plate is buffered; meanwhile, the middle plate is not inclined easily when moving up and down, and punching is more precise.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a multi-layer high-density multi-layer buried-hole printed board buried hole processing device and method. Background technique [0002] Printed boards are also called printed circuit boards and printed circuit boards. A multi-layer printed board refers to a printed board with more than two layers. It is composed of connecting wires on several layers of insulating substrates and pads for assembling and welding electronic components. The role of insulation. [0003] Existing printed boards are widely used in various aspects. However, the existing printed boards have the following defects in the processing process. First, the positioning of the holes on the board is prone to deviation during the processing process of the circuit board. Second, when the circuit board is punched, considering the unevenness of the surface of the circuit board, it is necessary to cla...

Claims

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Application Information

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IPC IPC(8): B26F1/24B26D7/26B26D7/02B26D7/08
CPCB26D7/02B26D7/08B26D7/2614B26D7/2628B26F1/24
Inventor 潘江国卢大伟刘腾方常
Owner ZHEJIANG ZAPON ELECTRONICS TECH
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