Multi-layer high-density multi-layer buried hole printed board buried hole processing device and method

A high-density, printed board technology, applied in metal processing and other directions, can solve problems such as shock absorption, and achieve the effects of avoiding punching deviation, convenient position adjustment, and convenient alignment punching

Active Publication Date: 2019-09-03
ZHEJIANG ZAPON ELECTRONICS TECH
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a multi-layer high-density multi-layer buried-hole printed board buried hole pro

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-layer high-density multi-layer buried hole printed board buried hole processing device and method
  • Multi-layer high-density multi-layer buried hole printed board buried hole processing device and method
  • Multi-layer high-density multi-layer buried hole printed board buried hole processing device and method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] The technical solutions of the present invention will be further described below in conjunction with the drawings and specific implementations.

[0029] Among them, the drawings are only used for exemplary description, and they are only schematic diagrams rather than physical drawings, and cannot be understood as a limitation of the patent; in order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, Enlargement or reduction does not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures in the drawings and their descriptions may be omitted.

[0030] The same or similar reference numbers in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" appear , "内", "外", etc. indicate the orient...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a multi-layer high-density multi-layer buried hole printed board buried hole processing device. The device comprises a base and vertical rods welded to the four corners of theupper end face of the base, a top plate is attached to the upper end faces of the vertical rods, a middle plate is arranged between the top plate and the base, and a second clamping groove is rotationally connected with a sliding rod. Due to the fact that T-shaped clamping blocks welded to the upper end faces of the vertical rods are in sliding connection with an annular groove, the top plate is rotationally adjusted, the position of a punching needle can be adjusted conveniently, and alignment punching is facilitated; due to the fact that clamping blocks are in sliding connection with the middle plate, the four clamping blocks are kept at the same horizontal plane, the phenomenon that punching is inclined due to the fact that the clamping blocks are inclined is avoided, and meanwhile, dueto the fact that a clamping ring and the base are elastically connected through a first compression spring, the middle plate is buffered; meanwhile, the middle plate is not inclined easily when moving up and down, and punching is more precise.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a multi-layer high-density multi-layer buried-hole printed board buried hole processing device and method. Background technique [0002] Printed boards are also called printed circuit boards and printed circuit boards. A multi-layer printed board refers to a printed board with more than two layers. It is composed of connecting wires on several layers of insulating substrates and pads for assembling and welding electronic components. The role of insulation. [0003] Existing printed boards are widely used in various aspects. However, the existing printed boards have the following defects in the processing process. First, the positioning of the holes on the board is prone to deviation during the processing process of the circuit board. Second, when the circuit board is punched, considering the unevenness of the surface of the circuit board, it is necessary to cla...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B26F1/24B26D7/26B26D7/02B26D7/08
CPCB26D7/02B26D7/08B26D7/2614B26D7/2628B26F1/24
Inventor 潘江国卢大伟刘腾方常
Owner ZHEJIANG ZAPON ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap