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Polyimide-based copolymer and polyimide-based film comprising the same

A technology of polyimide and copolymer, applied in the field of polyimide-based copolymer and polyimide-based film containing it, can solve the problems of film deformation, reduction of economic efficiency, increase of cost, etc.

Active Publication Date: 2022-07-26
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regarding the polyimide resin according to the above scheme, it is difficult to express sufficient heat resistance due to a curved structure or an aliphatic cyclic compound, and a film prepared using it still has a limitation of poor mechanical properties
[0007] In addition, polyimide resin is a material with high water absorption due to the amide bond, therefore, when used for engineering plastics, sufficient mechanical properties cannot be ensured, so that there are many restrictions in use
Although the absorption rate of polyimide films is controlled by conventional post-curing methods to address the above limitations, the films may be deformed due to additional processes, and economic efficiency may be reduced due to increased costs

Method used

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  • Polyimide-based copolymer and polyimide-based film comprising the same
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  • Polyimide-based copolymer and polyimide-based film comprising the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0113] 6.766 g (2.113 equiv, 0.02113 mol) 2,2'-bis(trifluoromethyl)benzidine (TMFB), 15.562 g (2.99 equiv, 0.0299 mol) 4,4'-bisphenol dianhydride (BPADA) and 150 ml of N-methylpyrrolidone (NMP) was added to a 500 mL round bottom flask equipped with a Dean-Stark apparatus and condenser, and the mixture was stirred at room temperature. Thereafter, 1.042 g (0.897 equivalent, 0.00897 mol) of hexamethylenediamine (HMDA) was dissolved in 16 ml of N-methylpyrrolidone (NMP), and then slowly dropped into the flask. After the addition of hexamethylenediamine (HMDA), the reaction mixture was stirred at room temperature for 4 hours under nitrogen atmosphere for reaction.

[0114] After the reaction, a polyamic acid polymer is formed. Then, the reaction mixture was combined with 3.170 g (0.99 equiv, 0.0099 mol) 2,2'-bis(trifluoromethyl)benzidine, 2.051 g (1.01 equiv, 0.010 mol) terephthaloyl dichloride (TPC) and 36 ml of additional N-methylpyrrolidone (NMP) was mixed and then stirred in ...

Embodiment 1

[0149] The polyimide-based copolymer obtained in Preparation Example 1 was dissolved in dimethylacetamide to prepare a polymer solution of about 20 (weight / volume). Pour the polymer solution on a glass plate, adjust the thickness of the polymer solution uniformly using a film applicator, and dry it in a vacuum oven at 20 °C for 12 hours or more to obtain a thickness of 20 μm to 30 μm. Polyimide based film.

experiment example 1

[0153] The following properties of the films of Example 1 and Comparative Examples 1 to 3 were evaluated by the following methods, and the results are shown in Table 1.

[0154] 1) Evaluation of water absorption (%)

[0155] The polyimide-based film was stored in a thermo-hygrostat at 85%±2% and 85°C±2°C for 15 hours, and then left to stand at room temperature to measure the weight change (water absorption) over time . The results are shown in Table 1 and figure 2 middle.

[0156] 2) Evaluation of glass transition temperature (Tg, °C)

[0157] Loss modulus of polyimide-based films was measured at 330°C under conditions of strain of 0.1%±0.005%, force of 0.05±0.0005, and frequency of 1±0.01 Hz. The glass transition temperature was measured by the temperature of the peak of the measured loss modulus, and the results are shown in Table 1 and image 3 middle.

[0158] [Table 1]

[0159] index Water absorption (%) Glass transition temperature (℃) Example ...

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Abstract

The present disclosure relates to polyimide-based copolymers and polyimide-based films comprising the same. The polyimide-based copolymer according to the present disclosure may provide a polyimide-based film exhibiting low absorbency while having excellent heat resistance and mechanical properties.

Description

technical field [0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims Korean Patent Application No. 10-2017-0083260 filed with the Korean Intellectual Property Office on June 30, 2017 and Korean Patent Application No. 10-2018-0075396 filed with the Korean Intellectual Property Office on June 29, 2018 , the disclosure of which is hereby incorporated by reference in its entirety. [0003] The present disclosure relates to polyimide-based copolymers and polyimide-based films comprising the same. Background technique [0004] Aromatic polyimide resins are polymers that mainly have an amorphous structure, and exhibit excellent heat resistance, chemical resistance, electrical properties, and dimensional stability due to their rigid chain structure. Polyimide resins are widely used as materials for electrical / electronic, aerospace, aviation and automotive fields. [0005] However, all aromatic polyimide resins are generally insoluble and have a high so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08G73/14C08L79/08C08J5/18
CPCC08G73/14C08J5/18C08J2379/08C08G73/1082C08G73/1039C08G73/1053C08L2203/16C08L79/08
Inventor 崔珹烈严瑛植金相坤崔炯三
Owner LG CHEM LTD