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Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure

A layer stack, component bearing technology, used in printed circuit components, semiconductor/solid-state device components, circuits, etc.

Pending Publication Date: 2019-09-20
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In particular, it is a challenge to efficiently manufacture component carriers with components embedded in the component carrier material

Method used

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  • Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure
  • Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure
  • Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure

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Embodiment Construction

[0063] Before describing example embodiments in more detail with reference to the accompanying drawings, some basic considerations upon which example embodiments of the invention are developed will be summarized.

[0064] According to example embodiments, a wafer level packaging (WLP) fabrication architecture in component carrier technology is provided, in particular enabling the implementation of high temperature resistant dielectric redistribution layer materials.

[0065] In a conventional wafer-level packaging (WLP) process in a fan-out architecture, silicon components can be surrounded by a molding material that increases the surface of the component for redistribution. Then, the entire surface can be covered with a redistribution layer. However, since the overall manufacturing process for such components in a fan-out architecture is not suitable for the use of high-temperature stable materials, the introduction of heat when laser drilling can cause damage to the redistri...

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PUM

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Abstract

A manufacturing method, a semi-finished product, a component carrier and an electronic device are provided. The manufacturing method, wherein the method comprises providing a layer stack (100) comprising at least partially uncured component carrier material (102), arranging a plurality of components (104) in recesses (114) of the layer stack (100), integrally connecting the components (104) with the layer stack (100) by curing the component carrier material (102, 102'), and applying a high temperature robust dielectric structure (106) on a main surface of the cured layer stack (100) with the components (104) therein.

Description

technical field [0001] The invention relates to a manufacturing method, a semi-finished product, a component carrier and an electronic device. Background technique [0002] In the case of increased product functions of a component carrier equipped with one or more electronic components, increased miniaturization of such electronic components, and an increase in the number of electronic components mounted on a component carrier such as a printed circuit board, increasingly Increasingly, more powerful array-like components or kits of several electronic components are used with multiple contacts or connections with even smaller spaces between these contacts. Removing the heat generated by such electronic components and the component carrier itself during operation is becoming an increasing problem. At the same time, the component carriers should be mechanically robust and electrically reliable in order to operate even under harsh conditions. [0003] In particular, it is a ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/683H01L23/482H01L23/488
CPCH01L24/02H01L24/11H01L24/13H01L24/81H01L21/6835H01L2224/0231H01L2224/02331H01L2224/02379H01L2224/02381H01L2224/11H01L2224/13016H01L2224/811H01L2221/68359H05K1/185H05K3/0052H05K3/0097H05K3/4682H05K2201/10378H05K2203/025H05K2203/166H01L21/561H01L24/19H01L24/96H01L24/97H01L2223/54493H01L2224/04105H01L2224/06181H01L2224/12105H01L2924/10253H01L2924/14H01L2924/18162H01L2924/3511H01L2924/35121H01L21/568H01L21/56H01L23/5226H01L23/5283H01L23/5329H01L24/09H01L24/17H01L2224/02373H05K1/0298H05K1/112H05K1/181H05K3/4038H05K3/4602H05K2201/0154
Inventor 约翰尼斯·施塔尔蒂莫·施瓦茨马里奥·朔贝尔
Owner AT & S AUSTRIA TECH & SYSTTECHN AG