Novel heat dissipation patch for electronic equipment

Abstract

The invention discloses a novel heat dissipation patch for electronic equipment, which comprises a micro-fiber sheet used for being fixed and bonded together with electronic equipment, a second heat conducting double-sided adhesive tape arranged on the lower end face of the micro-fiber sheet, a graphite sheet provided with a window in the middle and arranged on the lower end face of the second heat conducting double-sided adhesive tape, and a first heat conducting double-sided adhesive tape matched with the window in shape, arranged on the lower end face of the second heat conducting double-sided adhesive tape and located in the window, wherein the lower end face of the first heat conducting double-sided adhesive tape is flush with the lower end face of the graphite sheet. A large amount of heat generated by the electronic equipment during operation will be absorbed by the second heat conducting double-sided adhesive tape and transferred to the graphite sheet and will be dissipated by the graphite sheet, and thus, efficient heat conduction and heat dissipation effects are achieved. The novel heat dissipation patch is a sheet-like product and is thin, and can be applied to thinner electronic equipment. A wireless charger charges the electronic equipment wirelessly through the window of the graphite sheet. The graphite sheet will not affect wireless charging, and normal wireless charging is ensured.

Description

[0001] Technical field: [0002] The invention relates to the technical field of heat dissipation for electronic equipment, in particular to a novel heat dissipation patch for electronic equipment. [0003] Background technique: [0004] In order to make life more convenient, the rapid development of modern microelectronics technology has continuously developed various electronic devices, such as computers, mobile phones, tablet computers, etc. Wherein, since the electronic device generates a large amount of heat energy during operation, the heat energy will affect the running speed of the electronic device, or cause the electronic device to overheat and crash. [0005] For this reason, electronic equipment will increase heat sinks and fans to dissipate heat, but the increase in thickness will cause it to be unsuitable for thinner electronic equipment, such as mobile phones and tablet computers. [0006] Therefore, there is an urgent need for a material with high thermal condu...

AI Technical Summary

Problems solved by technology

Among them, since the electronic device will generate a large amount of heat energy during operation, the heat energy will affect the operating speed of the electronic device, or cause the electronic device to overheat and crash

[0005] For this reason, electronic equipment will increase radiators to cooperate with fans to dissipate heat, but it will cause an increase in thickness, so that it is not suitable for thinner electronic equipment, such as mobile phones and tablet computers.

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