Intensive lead frame

A technology of dense leads and lead frames, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of low resin utilization, low production efficiency, and glue overflow on the side of the pins, and achieves improvement. The effect of overflowing glue, uniform force and avoiding mucous membranes

Pending Publication Date: 2019-10-18
ZHEJIANG HENGTUO ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a dense lead frame to solve the problem of glue overflow and deformation on the side of the lead frame, low utilization rate of resin, and low production efficiency.

Method used

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Embodiment Construction

[0023] The patent of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] Such as figure 1 Shown is a dense lead frame according to an embodiment of the present invention. The model of the dense lead frame is TO94, which is formed by die-cutting a metal base tape, and includes a plurality of frame units 1 arranged side by side. In the example, the number of frame units 1 is 8, and the material of the metal base band is copper. In addition, the number of the frame units 1 can also be 7-10.

[0025] Such as figure 2 As shown, each frame unit 1 is composed of two symmetrical left and right column units 11, and a vertical main flow channel 12 is arranged between the left and right column units 11, which is used to fill the resin used for molding chips, and each column The upper and lower sides of the unit 11 are provided with metal frames 13, and the metal frames 13 on both sides are pr...

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Abstract

The invention provides an intensive lead frame. The frame comprises a plurality of frame units which are arranged in parallel in the left-right direction, wherein each frame unit is composed of a leftcolumn unit and a right column unit which are symmetrical, and a main runner is arranged between the left column unit and the right column unit; each column unit is composed of a plurality of rows ofunit structures, and each unit structure comprises a base island which is tightly attached to the main runner and is communicated with the main runner through a pouring gate and a pin which extends outwards relative to the base island. According to the intensive lead frame, the length of the main runner is shortened, so that the fit length of the pins of the intensive lead frame structure and a mold is shortened along with the main runner, the fit clearance between the pins and the mold and the stress of a unit structure are improved, and the situation that glue overflows from the side facesof the pins in the plastic packaging process is further improved; the base island of each unit structure is tightly attached to the main runner and is communicated with the main runner through the pouring gate, so that the stress is more uniform during demolding, thereby avoiding the problems of film sticking, glue breaking, layering and the like of the packaging resin of the product in the demolding process of the packaged product.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a lead frame. Background technique [0002] In the packaging process of manufacturing integrated chips, lead frames are the basic components of packaging. Such as figure 1 Shown is the structure of a traditional single-row lead frame (the package model is TO94, also called SIP-4L), which often needs to be placed horizontally relative to the mold when it is plastic-encapsulated, so as to be assembled together for injection molding. Therefore, it has the following disadvantages: [0003] Since the matching length of the leads of the single-row lead frame placed horizontally on the mold is too long, and the lead frame and the mold are made of different alloy materials, after the two are heated together, the matching gap G between the leads and the mold increases. Therefore, during the plastic sealing process, the side of the pin will be overflowed with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/495
CPCH01L23/3114H01L23/495
Inventor 不公告发明人
Owner ZHEJIANG HENGTUO ELECTRONIC TECH CO LTD
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