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A cob display module crystal bonding method

A display module and solid crystal technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of increased cost, low efficiency, etc., to reduce the probability of "spots", low cost, improve consistency and Show the effect of the effect

Active Publication Date: 2021-08-10
深圳市金翰半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ① and ② schemes start with grabbing the chip, and multiple die-bonding machines are mixed to achieve the purpose of uniform chip mixing, which has the problems of low efficiency and increased cost

Method used

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  • A cob display module crystal bonding method
  • A cob display module crystal bonding method
  • A cob display module crystal bonding method

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the description of the drawings and specific embodiments.

[0026] like Figure 6 to Figure 10 As shown, a COB display module crystal bonding method includes the following steps:

[0027] S1. Grab the crystal, starting from the chip in the first row and the first column, from top to bottom until the bottom chip of the column is finished, and then start grabbing from the bottom chip of the next column, from bottom to top until the column After the top chip is taken out, start to grab the top chip in the next column, from top to bottom until the bottom chip of the column is taken out, and so on until the chip is taken out;

[0028] Specifically, the long side of the first chip on the upper left of the vertical first column (the sorting of chips before shipment is to place the chip to the blue film in the direction parallel to the long side, and the chip can be directly dispersed and grasped in the ...

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Abstract

The invention provides a COB display module crystal-bonding method, comprising the following steps: S1, taking the crystal, taking the crystal along the direction perpendicular to the long side of the chip on a single blue film; S2, bonding the crystal, forming a square shape in two rows and two columns Distributed as a crystal-bonding unit, the position of the first row and the first column in each of the crystal-bonding units is position 1, and the position of the first row and the second column in each of the crystal-bonding units is position 2 , the position of the second row and the first column in each of the crystal-bonding units is position 3, and the position of the second row and the second column in each of the crystal-bonding units is position 4, from left to right, Complete the crystal-bonding of No. 1 position in all the crystal-bonding units from top to bottom, and then complete the crystal-bonding of No. 2, 3 and 4 positions successively in the same way. The beneficial effects of the present invention are: it can solve the plaque (mosaic) defect generated during die bonding with high efficiency and low cost, reduce the probability of COB "spot" formation, and improve the consistency and display effect of COB light emission.

Description

technical field [0001] The invention relates to a COB display module, in particular to a method for solidifying a COB display module. Background technique [0002] The LED COB display module refers to a display product that directly integrates multiple LED chips on the PCB. Thousands of LED chips need to be integrated on a single COB display module. [0003] Among them, the existing COB crystal bonding solutions are as follows: [0004] Crystal picking: automatically identify the first chip in the first row --> the last chip in the row ---> the last chip in the second row ---> the first chip in the second row... S-type cycle crystal picking , until the chip is removed, see figure 1 indicate the direction. [0005] Die bonding: the first unit at one end of the first column ---> the last unit at the bottom of the column ---> the last unit of the second column ----- the first unit of the second column... S-type cyclic die bonding , until the PCB board is soli...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/68H01L21/683
CPCH01L21/02H01L21/68H01L21/683
Inventor 罗新房
Owner 深圳市金翰半导体技术有限公司