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Light emitting diode epitaxial wafer and manufacturing method thereof

A technology for light-emitting diodes and a manufacturing method, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of decreased luminous efficiency, uneven distribution, and electron overflow, and achieves the effect of avoiding electron overflow and improving luminous efficiency.

Active Publication Date: 2019-10-22
HC SEMITEK SUZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The effective mass of electrons is small, the thermal migration speed is fast, and it is easy to inject into the multi-quantum well layer, and even transition to the P-type layer, resulting in uneven distribution of electrons in the multi-quantum well layer, and it is easy to cause electron overflow , which ultimately reduces the luminous efficiency of the LED

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  • Light emitting diode epitaxial wafer and manufacturing method thereof
  • Light emitting diode epitaxial wafer and manufacturing method thereof
  • Light emitting diode epitaxial wafer and manufacturing method thereof

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Embodiment Construction

[0026] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0027] The embodiment of the present invention provides a light emitting diode epitaxial wafer. figure 1 It is a schematic structural diagram of a light emitting diode epitaxial wafer provided by an embodiment of the present invention. See figure 1 The light-emitting diode epitaxial wafer includes a substrate 10, a buffer layer 20, an N-type layer 30, an electron adjustment layer 40, a multiple quantum well layer 50, and a P-type layer 60 stacked in sequence. figure 2 It is a schematic diagram of the structure of the electron adjustment layer provided by an embodiment of the present invention. See figure 2 , The electron adjustment layer 40 is composed of multiple composite structures 400 stacked in sequence, and each composite structure 400...

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Abstract

The invention discloses a light emitting diode epitaxial wafer and a manufacturing method thereof, and belongs to the technical field of semiconductors. The light emitting diode epitaxial wafer comprises a substrate, a buffer layer, an N-type layer, an electronic adjustment layer, a multi-quantum well layer and a P-type layer, wherein the substrate, the buffer layer, the N-type layer, the electronic adjustment layer, the multi-quantum well layer and the P-type layer are stacked in sequence. The electronic adjustment layer is composed of a plurality of composite structures which are stacked insequence, and each composite structure is composed of a first sub-layer, a second sub-layer, a third sub-layer and a fourth sub-layer, wherein the first sub-layer, the second sub-layer, the third sub-layer and the fourth sub-layer are stacked in sequence. Each of the first sub-layer and the fourth sub-layer is a BAlN layer, and in the same composite structure, the content of a component B in the first sub-layer is greater than the content of a component B in the fourth sub-layer. The second sub-layer is an undoped GaN layer, and the third sub-layer is an undoped InGaN layer. According to the invention, the BAlN / GaN / InGaN / BAlN superlattice structure is additionally arranged between the N-type layer and the multi-quantum well layer, so that more electrons can be conveyed into the quantum well for composite luminescence.

Description

Technical field [0001] The invention relates to the field of semiconductor technology, in particular to a light-emitting diode epitaxial wafer and a manufacturing method thereof. Background technique [0002] A light emitting diode (English: Light Emitting Diode, abbreviated as: LED) is a semiconductor electronic component that can emit light. InGaN-based LEDs are considered to be a new generation of luminous light sources, with the advantages of high efficiency, low energy consumption, and long service life, and are expected to replace traditional incandescent and fluorescent lamps. [0003] The epitaxial wafer is the main component of the LED. The existing LED epitaxial wafer includes a substrate, a buffer layer, an N-type layer, a multiple quantum well layer, and a P-type layer stacked in sequence. The substrate is used for epitaxial growth to provide a growth surface, the buffer layer is used to provide a nucleation center for epitaxial growth, the multiple quantum well layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/06H01L33/14H01L33/00
CPCH01L33/007H01L33/06H01L33/14
Inventor 陶章峰胡烨伟程金连曹阳乔楠李鹏胡加辉
Owner HC SEMITEK SUZHOU
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