Process for cleaning harmful elements of LED packaging carrier

Abstract

The invention discloses a process for cleaning harmful elements of an LED packaging carrier. The process comprises the following specific process steps that firstly, after a valve body is disassembled, ceramic sealing ring fittings are separated; secondly, (1) sealing ring ceramic is cleaned by using alcohol; (2) the LED carrier is cleaned by using an ultrasonic cleaning machine; thirdly, the ultrasonic cleaning machine is started, the carrier is soaked with industrial acetone; fourthly, an air gun is taken out for blowing after 10-20min of frequency vibration; fifthly, whether residues existin the carrier is examined; sixthly, (1) the LED carrier is cleaned again through the ultrasonic cleaning machine again if residues exist; (2) if no residue exists, the carrier continues to be soakedwith alcohol for 3-5min and is blown by the air gun; seventhly, the carrier is soaked with clean water for 3-5min and taken out to be blown by the air gun; and eighthly, the carrier is placed into anoven at the temperature of 60-80 DEG C to be baked for 5-10min. After soaking in acetone and ultrasonic vibration, baking of the oven is increased through alcohol and water to meet the requirement ofthorough cleaning. Therefore, the appearance problems of wrinkles, pits, bulges, water waves and the like on the surface of the colloid during baking and drying of existing LED lamp beads and the influence on reliability are solved.

Description

technical field [0001] The invention relates to an LED package, in particular to a process for cleaning harmful elements of an LED package carrier. Background technique [0002] At present, cleaning the packaging carrier is a necessary process for LED packaging. If the carrier is not cleaned thoroughly, residues such as acetone will indirectly or directly cause wrinkles, pits, bumps, and water ripples on the surface of the colloid when the LED lamp beads are dried. Therefore, those skilled in the art provide a process for cleaning the harmful elements of the LED packaging carrier to solve the problems raised in the background art above. Contents of the invention [0003] The object of the present invention is to provide a process for cleaning the harmful elements of the LED packaging carrier, so as to solve the problems raised in the above-mentioned background technology. [0004] To achieve the above object, the present invention provides the following technical solution...

AI Technical Summary

Problems solved by technology

[0002] At present, cleaning the packaging carrier is a necessary process for LED packaging. If the carrier is not cleaned thoroughly, residues such as acetone will indirectly or directly cause wrinkles, pits, bumps, and water ripples on the surface of the colloid when the LED lamp beads are dried.

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