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Systems and methods for determining sampling maps for alignment measurements

A technique for measuring positions and samples, used in semiconductor/solid state device test/measurement, image enhancement, image analysis, etc.

Active Publication Date: 2021-05-14
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the number of alignment measurements performed in a production environment must be chosen to balance the accuracy of the model with the impact on throughput

Method used

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  • Systems and methods for determining sampling maps for alignment measurements
  • Systems and methods for determining sampling maps for alignment measurements
  • Systems and methods for determining sampling maps for alignment measurements

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Embodiment Construction

[0019] Reference will now be made in detail to the disclosed subject matter which is illustrated in the accompanying drawings. The invention has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are to be regarded as illustrative and not restrictive. It will be readily apparent to those skilled in the art that various changes and modifications in form and details can be made without departing from the spirit and scope of the invention.

[0020] Embodiments of the invention relate to systems and methods for determining a sampling map including measurement locations for measuring alignment on a semiconductor wafer. For example, a metrology tool may measure alignment data at multiple locations across a sample. Alignment data may include, but is not limited to, sample alignment data associated with alignment of a sample in a fabrication tool or production tool, or overlay data associated with...

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Abstract

A system for determining a sample map for alignment measurements includes a metrology tool and a controller. The controller defines a full sample map that includes a plurality of measurement locations. The controller directs the metrology tool to measure alignment at each measurement location of the full sample map for a plurality of samples to generate a reference alignment data set, and the controller generates a set of data, each of the full sample map Candidate sampling maps for subsets. The controller may further estimate an alignment based on the two or more candidate sample maps at each measured position of the full sample map in terms of position, and by comparing the estimated alignment with the reference pair A working sample map is determined by aligning the data set and selecting the candidate sample map with the minimum number of alignment estimates exceeding a selected tolerance.

Description

[0001] Cross References to Related Applications [0002] This application is asserted under 35 U.S.C. § 119(e) filed January 5, 2017 by Brent Allen Riggs, Onur Nihat Demiry SAMPLING OPTIMIZATION METHODS FOR OVERLAY AND ALIGNMENT OUT OFSPEC POINT REDUCTION, inventors of Onur Nihat Demirer and William Pierson to US Provisional Application Serial No. 62 / 442,843, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates generally to alignment metrology, and more particularly to determining sampling locations for alignment metrology. Background technique [0004] At various steps in the fabrication process, the semiconductor wafer must be accurately positioned within the fabrication tool to properly produce printed features. Accordingly, a metrology tool may be utilized throughout the fabrication process to monitor the alignment of the wafer within the fabrication tool and / or the overlay of printed layers on the wafer. F...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67
CPCG06F15/76H01L22/30H01L22/12H01L22/22H01L22/24H01L21/67259G06T7/337G06T7/74G06T7/001G06T2207/30108G06T2207/10016G06F9/00
Inventor W·皮尔逊O·N·德米雷尔B·里格斯
Owner KLA CORP