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Cover glass and airtight package

A hermetic packaging, cover glass technology, applied in electrical components, electrical solid-state devices, semiconductor devices, etc., can solve problems such as thermal degradation of internal components

Active Publication Date: 2019-11-01
NIPPON ELECTRIC GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the softening temperature of glass powder is higher than that of organic resin-based adhesives, internal components may be thermally degraded during sealing.

Method used

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  • Cover glass and airtight package
  • Cover glass and airtight package
  • Cover glass and airtight package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0081] Hereinafter, the present invention will be described based on examples. It should be noted that the following examples are merely examples. The present invention is not limited by the following examples.

[0082] Table 1 shows examples (sample Nos. 1 to 7) of the present invention. Table 2 shows comparative examples (sample Nos. 8 to 14).

[0083] [Table 1]

[0084] No.1 No.2 No.3 No.4 No.5 No.6 No.7 Center line length [mm] 172 114 88 64 44 24 172 Average width [mm] 0.50 0.40 0.35 0.30 0.30 0.25 0.55 Average width / centerline length [%] 0.29％ 0.35％ 0.40％ 0.47％ 0.68％ 1.04％ 0.32％ Average thickness [μm] 0.6 0.6 0.6 0.6 0.6 0.6 0.6 air tightness ○ ○ ○ ○ ○ ○ ○

[0085] [Table 2]

[0086] No.8 No.9 No.10 No.11 No.12 No.13 No.14 Center line length [mm] 172 114 88 64 44 24 172 Average width [mm] 0.30 0.30 0.25 0.20 0.20 0.15 0.28 Averag...

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Abstract

This cover glass for an airtight package has a sealing material layer on one surface, wherein the cover glass for an airtight package is characterized in that the sealing material layer satisfies anyone of the following relationships (1)-(6). (1) When the center line length of the sealing material layer is at least 150 mm, the average width of the sealing material layer is 0.20% or more of the center line length of the sealing material layer. (2) When the center line length of the sealing material layer is at least 100 mm and less than 150 mm, the average width of the sealing material layer is 0.30% or more of the center line length of the sealing material layer. (3) When the center line length of the sealing material layer is at least 75 mm and less than 100 mm, the average width of thesealing material layer is 0.35% or more of the center line length of the sealing material layer. (4) When the center line length of the sealing material layer is at least 50 mm and less than 75 mm, the average width of the sealing material layer is 0.40% or more of the center line length of the sealing material layer. (5) When the center line length of the sealing material layer is at least 25 mmand less than 50 mm, the average width of the sealing material layer is 0.60% or more of the center line length of the sealing material layer. (6) When the center line length of the sealing material layer is less than 25 mm, the average width of the sealing material layer is 0.90% or more of the center line length of the sealing material layer.

Description

technical field [0001] The present invention relates to a cover glass and a hermetic package, and more specifically, to a cover glass and a hermetic package having a sealing material layer of a predetermined shape. Background technique [0002] A hermetic package generally includes a package base, a light-transmitting cover glass, and internal elements accommodated inside them. [0003] Internal elements such as MEMS (micro-electromechanical systems) elements mounted inside hermetic packages may be degraded by moisture infiltrated from the surrounding environment. Conventionally, in order to integrate the package base and the cover glass, an organic resin-based adhesive having low-temperature curability has been used. However, since organic resin-based adhesives cannot completely shield moisture or gas, internal components may deteriorate over time. [0004] On the other hand, if a composite powder containing glass powder and refractory filler powder is used as the sealing...

Claims

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Application Information

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IPC IPC(8): C03C27/06C03C27/00H01L23/02H01L23/08C03C8/24
CPCC03C3/145C03C8/24C03C8/04C03C8/16C03C27/06C03C27/00B81B7/0077B81C2203/019H01L23/08H01L23/10H01L23/15H01L23/31
Inventor 广濑将行
Owner NIPPON ELECTRIC GLASS CO LTD
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