A Large Size Ceramic Package Interface Structure
A technology of ceramic encapsulation and interface structure, applied in the direction of insulators, etc., can solve the problems such as the inability to effectively ensure the air-tightness of the large-sized vacuum insulation interface, the reduction of the vacuum performance of the vacuum insulation interface, and the large thermal expansion difference between the metal and the ceramic, etc. The effect of reducing the risk of explosion and improving reliability
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[0039] In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed", etc.
[0040] The present invention will be described in detail below.
[0049] In some possible embodiments, the side of the cylinder one 401 away from the support ring is provided with an annular protrusion,
[0050] FIG. 4 is a schematic cross-sectional view of the inner conductor support base 4 of the present invention along the front direction of OO'. The inner conductor support seat 4 consists of a cylinder 401,
[0067] In some possible embodiments, in order to facilitate the installation and positioning of the ceramic during the brazing seal, and to facilitate
[0078] The present invention is not limited to the foregoing specific embodiments. The present invention extends to any of the
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