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Ceramic packages and electronic devices

A technology of ceramic packaging and ceramic substrate, which is applied in the direction of semiconductor devices, electric solid devices, semiconductor/solid device components, etc., can solve the problems of cracks in insulating substrates and increased thermal stress, and achieve crack suppression, yield improvement, gas The effect of high reliability

Active Publication Date: 2018-10-16
NGK INSULATORS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, an extremely large welding current must be applied, and since the thermal stress generated by the large welding current also becomes large, there is a problem that the stress remaining between the insulating base and the cover after welding is likely to cause metallization for sealing. Cracks in layer and insulating matrix

Method used

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  • Ceramic packages and electronic devices
  • Ceramic packages and electronic devices
  • Ceramic packages and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0067] [Ceramic substrate]

[0068] First, when carrying out the first to third examples described below, various types of ceramic substrates (substrates 1 to 17) constituting the container 12 are prepared.

[0069] (substrate 1)

[0070] The raw material powder is Al with an average particle size of 1.5 μm2 o 3 Powder, MgO powder with an average particle size of 0.5 μm, SiO with an average particle size of 4.0 μm 2 Powder, MnCO with an average particle size of 3.0 μm 3 Powder and TiO with an average particle size of 0.25 μm 2 powder.

[0071] Raw material powder by the ratio shown in following table 2 (Al 2 o 3 Powder: 91.0% by mass, MgO powder: 0.30% by mass, SiO 2 Powder: 4.0% by mass, MnCO 3 Powder: 4.7% by mass (2.9% by mass in terms of MnO), TiO 2 Powder: 1.0% by mass) were mixed to obtain a mixed powder. SiO 2 and MnCO 3 The content ratio (SiO 2 / MnCO 3 ) by SiO 2 / MnO conversion is 1.38. In the obtained mixed powder, polyvinyl butyral, tertiary amine, a...

no. 1 Embodiment

[0119] For Examples 1 to 12 and Comparative Examples 1 to 3, the same type of ceramic substrate was used, and the ratio of the additive (B or P) to the main component (Ni) of the stress relaxation layer was changed, and the change in film hardness at this time was confirmed. And the occurrence rate of cracks after hermetic sealing.

Embodiment 1

[0121] As the ceramic substrate, substrate 1 is used, as the conductor paste, paste 1 is used, and the composition of the stress relaxation layer 28 is Ni-B (B is 0.9% by mass), based on figure 2 With the manufacturing method shown, 625 samples 1 were produced. As the high-temperature sealing material 16, the brazing material 3 in Table 1 above was used. In addition, the film thickness of the stress relaxation layer 28 was set to 3 μm. Similarly, 625 samples 2 to 6 were prepared using pastes 2 to 6 as conductor pastes. Take this as Example 1.

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Abstract

The present invention pertains to a ceramic package and an electronic component. A ceramic package (10) in which a ceramic vessel (12) with an upper surface opening and a lid (14) that closes off the opening of the vessel (12) are sealed using a high temperature sealant (16), wherein there is a bonding layer (24) between the top edge surface of a side wall (12b) of the vessel (12) and the high temperature sealant (16). The bonding layer (24) has a metallized layer (26) formed on the upper edge surface of the side wall (12b) and a stress relief layer (28) formed on top of the metallized layer (26). The stress relief layer (28) is a non-electrolytic plating layer having a film hardness of at least 50 to less than 500.

Description

technical field [0001] The present invention relates to a ceramic package, for example, a ceramic package and an electronic device suitable for mounting elements such as a vibrator inside. Background technique [0002] Conventionally, ceramic packages for mounting elements such as vibrators are known. This ceramic package is constructed by sealing a metal lid member to a ceramic container with an open upper surface by, for example, seam welding, using a high-temperature sealing material such as silver solder. In particular, in the ceramic package described in Japanese Patent No. 3652320, a metallization layer and a nickel (Ni) plating layer exist between the container and the high-temperature sealing material, and then the thickness of the metallization layer and the Ni plating layer is adjusted to suppress the occurrence of cracks. [0003] That is, if the thickness of the metallization layer for sealing is made larger than that of the Ni plating layer, the resistance of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/02H01L23/08H01L23/10
CPCH01L23/10H01L23/053H01L23/06H01L2924/0002H01L2924/00
Inventor 梅田勇治清水秀树
Owner NGK INSULATORS LTD
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