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Optical image recognition device and manufacturing method thereof

A technology of image recognition and production method, applied in the field of image recognition, can solve problems such as low yield rate, inability to receive light normally, and blockage of optical path.

Inactive Publication Date: 2019-11-05
RECO TECH CHENGDU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because there are cleaning process and cutting process in the CMOS packaging process, and these processes are all water processes, it is very easy for particles to fall into the optical path, causing blockage of the optical path, making the yield less than 50%, resulting in optical unable to receive normally

Method used

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  • Optical image recognition device and manufacturing method thereof
  • Optical image recognition device and manufacturing method thereof
  • Optical image recognition device and manufacturing method thereof

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Embodiment Construction

[0033] Embodiments of the present invention will be further explained in conjunction with the accompanying drawings below. Wherever possible, the same reference numerals represent the same or similar components throughout the drawings and description. In the drawings, the shape and thickness may be exaggerated for simplification and convenient labeling. It should be understood that elements not particularly shown in the drawings or described in the specification are forms known to those skilled in the art. Those skilled in the art can make various changes and modifications according to the content of the present invention.

[0034] When an element is referred to as being "on", it can generally mean that the element is directly on other elements, or that other elements exist between the two. Conversely, when an element is referred to as being "directly on" another element, it cannot have the other element in between. As used herein, the word "and / or" includes any combination...

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PUM

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Abstract

The invention discloses an optical image recognition device and a manufacturing method thereof. Firstly a substrate which is surrounded by multiple conductive connection pads is provided; then an image sensor is formed on the substrate; then an optical collimator having multiple through holes penetrating through the optical collimator is formed on the image sensor; then a first high-temperature-resistant adhesive is formed on the edge of the top of the optical collimator and an optical filter is formed on the first high-temperature-resistant adhesive, the through holes are shielded by the optical filter and multiple leads are electrically connected with the conductive connection pads around the image sensor; and finally an encapsulating colloid is formed around the image sensor and the substrate to cover the side walls of the optical collimator, the first high-temperature-resistant adhesive and the optical filter and cover the leads and the conductive connection pads so as to avoid dropping particles into the through holes and reduction of the optical receiving efficiency.

Description

technical field [0001] The present invention relates to an image recognition technology, and in particular to an optical image recognition device and a manufacturing method thereof. Background technique [0002] Typically, fingerprints have many features including ridges, valleys and finer points. Finer points include where the ridge bifurcates and where the ridge ends. Fingerprints can be regarded as unique biometric data, because the distribution of their characteristics is different and every person cannot have the same fingerprint. Therefore, the use of biometric data such as fingerprints in security systems can ensure effective and accurate protection of areas requiring security, movable assets, etc. Fingerprint identification devices used to acquire fingerprint images can generally be classified into capacitive devices and optical devices. For the full-screen panel, the lower area of ​​the screen that could originally accommodate fingerprint identification is also s...

Claims

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Application Information

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IPC IPC(8): H01L27/146H01L31/0203H01L31/0232
CPCH01L27/14618H01L27/14621H01L27/14685H01L27/14687H01L31/0203H01L31/02325
Inventor 张俊德刘忠武郭毓弼林信诚
Owner RECO TECH CHENGDU CO LTD