Stamping die for patch diode lead frame

Abstract

The invention discloses a stamping die for a patch diode lead frame. The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die module; the movable die module comprises an auxiliary stripping structure, a plurality of guide posts, afirst stamping structure and a second stamping structure; the auxiliary stripping structure comprises a stripping driving piece and an abutting plate, and the stripping driving piece is fixedly connected with the abutting plate and drives the abutting plate to move; the first stamping structure and the second stamping structure are each provided with a plurality of punches; the female die module comprises a plurality of guide sleeves, supporting blocks and blanking grooves; the guide posts are accommodated in the guide sleeves in a matched mode; the first stamping structure and the second stamping structure face to the blanking grooves; the abutting plate abuts against the surface of the female die module when in a die closing state; and the stripping driving piece drives the abutting plate to move, and the guide posts are assisted to be separated from the guide sleeves. The stripping is simple, the burden of a worker is relieved, and meanwhile, the side protection structures protect the side part of the whole device, and collision damage in the hoisting process is avoided.

Description

technical field [0001] The invention relates to the field of diodes, in particular to a stamping die for a chip diode lead frame. Background technique [0002] Currently, a diode is a device with two electrodes among electronic components, which only allows current to flow in a single direction, and many uses are for its rectification function. The varactor diode is used as an electronic adjustable capacitor. The current directionality of most diodes is commonly referred to as the "rectification" function. The most common function of a diode is to only allow current to pass in one direction and block it in the reverse direction. [0003] However, the existing diode production process has the following defects: [0004] The production of diodes on the market generally stamps copper sheets. The existing copper sheet stamping dies may jam during the mold opening and maintenance process, and the guide posts may be jammed. It is difficult to remove the film, and often requires...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to provide a stamping die for a chip diode lead frame, which can solve the problem of inconvenient assembly and disassembly

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