Tail gas cleaning unit, tail gas cleaning device and vapor deposition equipment

A vapor deposition and cleaning device technology, which is applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of reducing production efficiency, vacuum pump stuck, shortening maintenance cycle, etc., to eliminate particles and improve production Efficiency and reduced maintenance time

Active Publication Date: 2019-11-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once the temperature changes or the pump is stopped, the vacuum pump 500 will

Method used

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  • Tail gas cleaning unit, tail gas cleaning device and vapor deposition equipment
  • Tail gas cleaning unit, tail gas cleaning device and vapor deposition equipment
  • Tail gas cleaning unit, tail gas cleaning device and vapor deposition equipment

Examples

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Embodiment Construction

[0045] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0046] It should be pointed out that in the present invention, the orientation words "up and down" used are figure 2 and image 3 in the up and down direction.

[0047] As an aspect of the present invention, image 3 As shown, an exhaust gas cleaning unit 100 for vapor deposition equipment is provided, wherein the exhaust gas cleaning unit includes an injection chamber and a filter structure 130 .

[0048]The injection chamber includes an outer wall 110 and an inner wall 120 , the inner wall 120 is formed in a cylindrical shape with an inner cavity, the outer wall 110 surrounds the inner wall 120 , and the outer wall 110 and the inner wall 120 are spaced apa...

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PUM

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Abstract

The invention provides a tail gas cleaning unit for vapor deposition equipment. The unit involves an injection cavity and a filter screen structure, wherein the injection cavity comprises an outer side wall and an inner side wall, the inner side wall is formed into a cylindrical shape with an inner cavity, the outer side wall is arranged around the inner side wall and is separated from the inner side wall, an injection hole penetrating through the inner side wall in the thickness direction of the inner side wall is formed in the inner side wall, a fluid inlet penetrating through the outer sidewall in the thickness direction of the outer side wall is formed in the outer side wall so that a fluid flowing into an opening of one end of the inner cavity defined by the inner side wall can flowout from an opening of the other end of the inner cavity defined by the inner side wall through the filter screen structure. The invention further provides a tail gas cleaning device and the vapor deposition equipment. According to the vapor deposition equipment, few residual particles or even no residual particles exist in a tail gas treatment pipeline device so that the maintenance period of a vacuum pump can be prolonged.

Description

technical field [0001] The present invention relates to the field of vapor deposition equipment, in particular to an exhaust gas cleaning unit, an exhaust gas cleaning device comprising the exhaust gas cleaning unit, and a vapor deposition equipment comprising the exhaust gas cleaning unit. Background technique [0002] The so-called vapor deposition refers to forming a film layer structure on a substrate set in the process chamber by passing process gas into the process chamber of the vapor deposition equipment. The vapor deposition equipment includes a tail gas pipe for discharging the reaction tail gas from the process chamber. After the deposition step is completed, the excess process gas needs to be drawn out of the process chamber through the tail gas pipe by using a vacuum pump. [0003] During the above process, the unreacted process gas may be further deposited on the pipe wall of the tail gas pipe and the valve installed in the tail gas pipe, which may not only aff...

Claims

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Application Information

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IPC IPC(8): C23C16/44
CPCC23C16/4407C23C16/4408
Inventor 兰云峰史小平李春雷王勇飞王帅伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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