PCB surface copper thickness measuring machine and measuring method

Abstract

The invention discloses a PCB surface copper thickness measuring machine, which comprises measuring heads for measuring the thickness of copper on the surface of a PCB; a conveying device for conveying the PCB; and a computer control system connected with the a conveying device drive device and a copper thickness measuring instrument. The copper thickness measuring heads are arranged above and under the PCB conveying device; the copper thickness measuring heads are mounted on a drive device that can move synchronously with the PCB and keeps the copper thickness measuring heads static relativeto the PCB; and copper thickness measuring head drive devices are connected with the computer control system for controlling the copper thickness measuring head drive devices. According to the method,whole plate devices move synchronously with the PCB during material input of the PCB surface copper thickness measuring machine; during measuring, the copper thickness measuring heads move synchronously with the PCB, and in the measuring process, the PCB does not stop; and meanwhile, since the copper thickness measuring heads are arranged above and under the PCB conveying device, the thickness ofthe copper on the upper and lower surfaces of the PCB at the same position can be measured synchronously, thereby improving work efficiency of the PCB surface copper thickness measuring machine.

Description

technical field [0001] The invention belongs to the field of measuring thickness, and in particular relates to an improvement on a measuring device and method for copper thickness on the surface of a PCB board. Background technique [0002] When the PCB factory leaves the factory, it is necessary to measure the thickness of the copper foil on the surface of the circuit board to detect whether the PCB board meets the customer's requirements and to eliminate unqualified products by statistical pass rate. The special machine for foil thickness (with reference to the patent publication number CN207991502U named copper foil thickness measuring machine) can solve the problem of automatic production of surface copper foil thickness classification. However, when the copper thickness measuring machine measures, the PCB board needs to stop in the machine, and other production steps can only be continued after the measurement is completed. This is obviously not conducive to improving t...

AI Technical Summary

Problems solved by technology

However, when the copper thickness measuring machine measures, the PCB board needs to stop in the machine, and other production steps can only be continued after the measurement is completed. This is obviously not conducive to improving the production efficiency of the assembly line. The purpose of this technical solution is to solve the problem that the PCB board needs to be stopped during measurement. A new solution to improve measurement efficiency when measuring PCB boards

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