Heat leading-out device of cabinet

Abstract

The invention discloses a heat leading-out device of a cabinet. The heat leading-out device comprises an MCU controller body, a flip cover, an insertion cover, cooling fins, a dustproof net, a fan, anadhesive layer and a positioning rod. The flip cover is arranged at the top end of the MCU controller body, the fan is mounted in a groove, and the insertion cover is mounted at the other end, closeto the outer side of the fan, of the MCU controller body in a sleeving manner; the dustproof net is mounted in the insertion cover, and the upper flexible glue is installed in a clamp; the positioningrod is mounted at the bottom end of the flip cover, and the adhesive layer is mounted at the bottom end of the MCU controller body. The heat leading-out device is scientific and reasonable in structure and is safe and convenient to use; by arranging the cooling fins and the fan, the heat dissipation of the MCU controller is facilitated; by arranging the double-layer flexible glue, the dust can beprevented from entering the wiring ports; by arranging the dustproof net and the insertion cover, the installation of the dustproof net is facilitated; by arranging the positioning rod and a slot, the disassembly of the MCU controller is facilitated; and by arraning the adhesive layer, the fixing of the MCU controller is facilitated.

Description

technical field [0001] The invention relates to the technical field of controllers, in particular to a heat export device for a cabinet. Background technique [0002] MCU controller, also known as single-chip microcomputer or single-chip microcomputer, is to appropriately reduce the frequency and specifications of the central processing unit, and to form a chip with peripheral interfaces such as memory, counter, USB, A / D conversion, UART, PLC, and DMA. Class computer, do different combination control for different application occasions. [0003] However, the MCU controllers currently on the market are not only complex in structure, but also have a single function. There is no heat sink and fan, which is not convenient for the heat dissipation of the MCU controller. And the cover, it is not convenient to install the dust filter, there is no positioning rod and slot, it is not convenient to disassemble the MCU controller, and there is no adhesive layer, it is not convenient t...

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a heat exporting device for a cabinet, which can effectively solve the problems mentioned in the background art that there is no heat sink and fan, which is inconvenient for the heat dissipation of the MCU controller, and there is no double-layer soft glue, which cannot prevent dust from entering the wiring port. The dust-proof net and plug cover are not convenient for the installation of the dust-proof net. There are no positioning rods and slots, which make it difficult to disassemble the MCU controller. There is no adhesive layer, which makes it difficult to fix the MCU controller.

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