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Polishing pad cleaning method and device

A technology for cleaning devices and polishing pads, applied in cleaning methods and tools, abrasive surface adjustment devices, cleaning methods using tools, etc., can solve the problems of scratches on the wafer surface, particles falling on the polishing pad, residues, etc., to achieve Avoid scratching effect

Inactive Publication Date: 2019-12-03
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
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AI Technical Summary

Problems solved by technology

Since the wafer grinding is done sequentially one by one, before the next wafer is placed on the polishing pad, there is about 20 seconds of idle time on the polishing pad, and particles may fall on the polishing pad at this time, and when the grinding head rotates to When the polishing pad is in position, the residual particles on the grinding head or the grinding particles in the grinding chamber fall onto the polishing pad, and secondary particles will remain on the polishing pad, and the remaining particles on the polishing pad will cause scratches on the wafer surface

Method used

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  • Polishing pad cleaning method and device
  • Polishing pad cleaning method and device
  • Polishing pad cleaning method and device

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Embodiment Construction

[0022] The present invention is described in detail below in conjunction with accompanying drawing:

[0023] Please refer to figure 1 , an embodiment of the present invention provides a method for cleaning a polishing pad, comprising:

[0024] Step 10, before the wafer is polished, the polishing pad is washed with high-pressure liquid or high-pressure gas, and the polishing pad is brushed with a cleaning brush.

[0025] Step 20, after the wafer is ground, the polishing pad is scrubbed with a cleaning brush.

[0026] The high-pressure liquid may be water such as pure water.

[0027] Please refer to Figure 4 , the embodiment of the present invention also provides a polishing pad cleaning device, including a flushing device 1 for cleaning the polishing pad and a brushing device 2 for cleaning the polishing pad. The grinding pad 3 is arranged on a rotating table 4 of the grinding equipment, and the rotating table 4 is rotated by a rotating shaft 5 . Wherein the flushing devi...

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Abstract

The invention provides a polishing pad cleaning method and device, and the method comprises the steps: flushing a polishing pad through high-pressure liquid or high-pressure gas before a wafer is polished, and scrubbing the polishing pad through a cleaning brush; after the wafer is ground, brushing the grinding pad through the cleaning brush. The device comprises a flushing device for cleaning thegrinding pad and a brushing device for cleaning the grinding pad. According to the invention, when the wafer is ground, the wafer can be prevented from being scratched.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a polishing pad cleaning method and device. Background technique [0002] Chemical mechanical polishing is a surface planarization process in semiconductor manufacturing. The process of chemical mechanical polishing is to place the wafer on a rotating polishing pad, and add chemical polishing fluid to the wafer through a polishing head that exerts a certain pressure to polish the wafer to flatten the surface of the wafer. After the wafer is polished, by-products such as abrasive particles will remain on the surface and grooves of the polishing pad. Therefore, after the wafer is polished, the polishing pad needs to be cleaned with a cleaning brush, and there may be particles remaining on the polishing pad. . Since the wafer grinding is done sequentially one by one, before the next wafer is placed on the polishing pad, there is about 20 seconds of idle time on the polishin...

Claims

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Application Information

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IPC IPC(8): B24B53/017B08B3/02B08B5/02B08B1/00
CPCB24B53/017B08B3/02B08B5/02B08B1/12
Inventor 同小刚
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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