High-precision grinding device for chip silicon producing and operating method

Abstract

The invention discloses a high-precision grinding device for chip silicon producing. The device comprises a bottom plate, rectangular supporting rods are fixedly connected to four corners of the bottom surface of the bottom plate, a rectangular supporting plate is arranged below the bottom surface of the bottom plate, the top surface of one end of the supporting plate is provided with a filteringbox, one side of the filtering box is provided with an air sucking pump, the top surface of the other end of the supporting plate is provided with a power distributing box, a first motor is arranged in the middle of the top surface of the supporting plate, a rotating shaft is arranged in front of the first motor, a lower grinding disc is arranged at the top end of the rotating shaft, clamping assemblies are arranged at the two ends of the top surface of the bottom plate, a supporting column is arranged at the top surface of one end of the bottom plate, a fixing plate is arranged at the top endof the supporting column, an illuminating lamp, an electric telescopic rod and a dust hood are arranged on the fixing plate, a second motor is arranged at the movable end of the electric telescopic rod, an upper grinding disc is arranged on a motor shaft of the second motor, and the dust hood is connected with the air sucking pump through a dust sucking pipe. The invention further discloses an operating method of the high-precision grinding device for chip silicon producing. According to the device and the method, the structure is simple, the working efficiency is improved, the dust pollutionis reduced, and the environment is protected.

Description

technical field [0001] The invention relates to the technical field of chip silicon processing equipment, in particular to a high-precision grinding device for chip silicon production and an operation method. Background technique [0002] Existing wafer grinding and processing equipment will generate a large amount of grinding dust during the working process, which seriously pollutes the environment. When grinding a wafer, usually the grinding disc first grinds the upper surface of the wafer, and then turns it over 180° to grind the other side, which undoubtedly increases the labor intensity of the workers, and there is also the defect of discontinuous grinding. Reduced grinding efficiency. Contents of the invention [0003] The purpose of the present invention is to solve the shortcomings in the prior art, and propose a high-precision grinding device for chip silicon production. [0004] In order to achieve the above object, the present invention adopts the following te...

AI Technical Summary

Problems solved by technology

[0002] Existing wafer grinding and processing equipment will generate a large amount of grinding dust during the working process, which seriously pollutes the environment. When grinding a wafer, usually the grinding disc first grinds the upper surface of the wafer, and then turns it over 180° to grind the other side, which undoubtedly increases the labor intensity of the workers, and there is also the defect of discontinuous grinding. Reduced grinding efficiency

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