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Slicing machine height measuring method, height measuring device and dicing machine

A technology of height measuring device and dicing machine, which is applied in the direction of measuring devices, fine working devices, instruments, etc., can solve the problems of inability to measure the height of workpieces, low efficiency of scribing, and inability to realize the continuity of cutting work, so as to ensure the scribing Chip accuracy, improve scribing efficiency, improve the effect of measuring high precision

Active Publication Date: 2021-08-03
光力瑞弘电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for measuring the height of a dicing machine to solve the problem that the current dicing machine cannot measure the height of the workpiece in the process of cutting the workpiece, which can not realize the continuity of the cutting work, and thus cause the problem of low scribing efficiency ; In addition, the purpose of the present invention is also to provide a kind of dicing machine height measuring device; In addition, the purpose of the present invention is also to provide a kind of dicing machine

Method used

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  • Slicing machine height measuring method, height measuring device and dicing machine
  • Slicing machine height measuring method, height measuring device and dicing machine
  • Slicing machine height measuring method, height measuring device and dicing machine

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Embodiment Construction

[0044] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0045] The specific embodiment of the dicing machine of the present invention, as Figure 1 to Figure 8 As shown, the dicing machine includes a frame, a workbench 2, and a workpiece carrying plate 3 arranged on the workbench 2. The workpiece carrying plate 3 has a workpiece carrying surface 31 for carrying workpieces to be cut. The workpiece carrying surface 31 in this embodiment The disk 3 is a ceramic disk, and the workpiece to be cut is a wafer 70 fixed on the ceramic disk by vacuum adsorption to ensure the stability of the workpiece during cutting. The frame is equipped with a main shaft moving mechanism and a main shaft arranged on the main shaft moving mechanism. The main shaft is used to install and drive the scribing knife 5. The main shaft moving mechanism is used to drive the main shaft to move along the Z and Y directions. The mobile is assem...

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Abstract

The invention relates to a height measuring method for a dicing machine, a height measuring device and a dicing machine. The dicing machine includes a workbench, a workpiece carrying plate, a spindle, a height measuring device and a control system. The height measuring device is arranged on the workbench on the workpiece carrying plate Sideways to avoid the workpiece on the workpiece carrying plate; the height measuring device includes a height measuring body and a contact detection device, and the height measuring body has a height measuring surface for contacting with the scribing knife to measure the height of the scribing knife; the contact detection device and The signal connection of the control system is used to detect the contact between the scribing knife and the height measuring body, and is triggered to send a signal to the control system when the scribing knife is in contact with the height measuring body. During the scribing process of the workpiece, the scribing knife can be moved to the height measuring device at any time for height measurement, and the height of the scribing knife can be adjusted according to the height measurement result to ensure the scribing accuracy and improve the scribing efficiency. The current dicing machine cannot measure the height of the workpiece during the cutting process, which results in the inability to realize the continuity of the cutting work, which in turn causes the problem of low scribing efficiency.

Description

technical field [0001] The invention relates to a height measuring method for a dicing machine, a height measuring device and a dicing machine. Background technique [0002] The dicing machine is an important processing equipment in the field of semiconductor packaging and processing technology. At present, the grinding wheel dicing machine is widely used in the market. The high-speed rotating diamond scribing knife on the grinding wheel dicing machine will continue to wear during use. If the dicing Without adjusting the height of the knife, the cutting depth on the workpiece will gradually become shallower. In order to ensure the accuracy of the measurement results, it is necessary to detect the wear degree of the scribing knife online, and adjust the height of the spindle relative to the worktable according to the wear of the scribing knife. The height measuring device measures the height of the scribing knife through the height measuring device, and adjusts the height of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/00B28D7/04B28D5/02G01B21/02
CPCB28D5/0058B28D5/0094B28D5/022G01B21/02
Inventor 赵彤宇司亚辉郑海全李港生王亚明
Owner 光力瑞弘电子科技有限公司
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