Thin capillary structure supporting uniform temperature plate

Abstract

The invention provides a thin capillary structure supporting uniform temperature plate. A capillary structure in an inner cavity of the uniform temperature plate has the function of supporting a forcestructure while serving as a phase change medium capillary force structure of the uniform temperature plate. The heat conduction capacity and the heat dissipation efficiency of the uniform temperature plate are improved. The thin capillary structure supporting uniform temperature plate comprises a first cover plate and a second cover plate. The center area of the first cover plate is provided with an upward convex cavity. The second cover plate is of a flat plate structure. The periphery area of the second cover plate is covered with an outer frame of the first cover plate. The uniform temperature plate further comprises a capillary supporting structure. One surface of the overall plane area of the capillary supporting structure is provided with a plurality of outward convex supporting components. The capillary supporting structure is located in the upward convex cavity. The plane surface of the overall plane area of the capillary supporting structure is attached to the inner surfaceof the upward convex cavity. Outward convex points of the supporting components form an equivalent plane and are attached to the inner surface of the second cover plate.

Description

technical field [0001] The invention relates to the technical field of a uniform temperature plate structure, in particular to a thin capillary structure supporting a uniform temperature plate. Background technique [0002] With the development of science and technology and the improvement of people's living standards, high heat flux heat dissipation and high temperature uniformity are the current development trends of load heat dissipation technology. The good thermal conductivity of the vapor chamber makes it more and more widely used, and the electronic chips and devices are becoming lighter and thinner, and the vapor chamber with thinner and simpler processing technology is more and more in demand. [0003] The vapor chamber in the prior art has the following deficiencies in terms of technology and structure: [0004] 1. The cover plate generally adopts CNC / etching processing technology as the supporting structure, which reduces the soaking area, high scrap rate, large ...

AI Technical Summary

Problems solved by technology

[0004] 1. The cover plate generally adopts CNC / etching processing technology as the supporting structure, which reduces the soaking area, high scrap rate, large pollution, high cost, and it is difficult to achieve real thinning;

[0005] 2 Use other auxiliary structures to support the vapor chamber, such as columns, or concave-convex bodies, which will increase the processing flow and difficulty of the vapor chamber, and it is also difficult to make it thinner;

[0006] 3 The pumping and liquid injection port requires an additional sleeve for external connection operation, and a complicated (pressing + welding) sealing operation is required after the pumping and liquid injection is completed;

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