Punching mold device capable of rotating a workpiece and punching method using same
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- QUANTA COMPUTER INC
- Publication Date
- 2019-12-20
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a stamping die device, in particular to a stamping die device capable of rotating workpieces and a stamping method using the stamping die device. Background technique
[0002] Stamping is to rely on presses and molds to apply external forces to workpieces (such as plates, strips, pipes and profiles, etc.) to cause deformation or separation (such as cutting, bending or punching grooves, etc.), so as to obtain the desired shape and size of the workpiece forming processing method.
[0003] In the traditional stamping die, if it is necessary to stamp the circumferential surface of the cylindrical workpiece at 360 degrees in multiple angles and in different directions, it is necessary to disassemble various multi-stations to complete the required process. It not only makes the processing procedure complicated, but also causes inconvenience to the operators. Furthermore, during production, the above-mentioned traditional sub-statio...