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Low-voltage packaging process of circuit board

A packaging process and circuit board technology, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of difficult shape control, uncontrollable package size, poor circuit board effect, etc.

Inactive Publication Date: 2019-12-31
刘程秀
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shape of the cured circuit board produced by this type of encapsulation method is not easy to control and irregular, and chemical potting such as UV, epoxy, PU, ​​glue, etc. has poor effect on the encapsulation (ie bonding) of the circuit board. Size cannot be controlled

Method used

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Examples

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Comparison scheme
Effect test

Embodiment Construction

[0005] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly. Described in the present invention is a kind of low-voltage encapsulation technology of circuit board of electronic component, comprises following steps 1. will need the circuit board of encapsulation to carry out surface cleaning treatment, realize surface cleaning and provide surface energy; 2. circuit board after processing is placed Put it into the mold, add packaged additives for pressure curing to realize the package of electronic components on the circuit board; 3. Remove the packaged circuit board electronic components. Further, the additive in the described step 2 is hot melt adhesive. Further, the injection molding pressure processed in said step 2 is O. L-100bar. Further, the curing ti...

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PUM

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Abstract

The invention provides a low-voltage packaging process of a circuit board, which comprises the following steps of: (1) processing a circuit board to be packaged to realize surface cleaning and providesurface energy, (2) putting the processed circuit board into a mold, and adding a packaging additive for pressurizing and curing to realize packaging of electronic components on a circuit board, and(3) taking down the packaged electronic components of the circuit board. According to the process, low-voltage injection molding packaging is adopted, the packaging efficiency is high, electronic components cannot be damaged, product appearance molding is neat and easy to control, 100% packaging of parts needing to be packaged is achieved, and the effects of sealing, moisture prevention, water prevention, dust prevention and chemical corrosion resistance are achieved on the molded parts.

Description

technical field [0001] The invention relates to a manufacturing process, in particular to a low-voltage packaging process for circuit boards of electronic components. Background technique [0002] The packaging methods in the prior art mainly include chemical potting such as UV, epoxy, PU, ​​and glue. The implementation steps of this type of chemical potting are as follows: the first step is to fix the existing electronic component circuit board in a special tool, and dispensing glue through special equipment; the second step is to cure through special light source equipment and other heating equipment , to realize the encapsulation of the circuit board at one time. The shape of the cured circuit board produced by this type of encapsulation method is not easy to control and irregular, and chemical potting such as UV, epoxy, PU, ​​glue, etc. has poor effect on the encapsulation (ie bonding) of the circuit board. Size cannot be controlled. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 刘程秀
Owner 刘程秀