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Thermoelectric cooler (TEC) for spot cooling of 2.5d/3d IC packages

A technology for encapsulating lids and encapsulating substrates, which is applied in the fields of machines using electric/magnetic effects, electric solid devices, semiconductor/solid state device manufacturing, etc.

Active Publication Date: 2019-12-31
GOOGLE LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the use of 2.5D / 3D packaging technology produces compact IC packages, it also presents challenges for thermal management

Method used

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  • Thermoelectric cooler (TEC) for spot cooling of 2.5d/3d IC packages
  • Thermoelectric cooler (TEC) for spot cooling of 2.5d/3d IC packages
  • Thermoelectric cooler (TEC) for spot cooling of 2.5d/3d IC packages

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Embodiment Construction

[0017] High-bandwidth memory (HBM) provides memory bandwidth far beyond what conventional memory devices such as DDR4 and GDDR5 can provide, and saves cost and power. HBM is designed as in-package memory and is usually located next to the processor or ASIC. Multiple HBM components can be integrated with a single by using 2.5D / 3D packaging technology. While 2.5D / 3D packaging technology yields compact IC packages, it also presents challenges for thermal management. Example 2. A 5D / 3D package may include an ASIC placed at the center of a package surrounded by multiple HBM components. In this package configuration, the ASIC will typically dissipate about 90% of the power across the package during normal operation. While HBM components only dissipate 10% of the overall package power, they drive the thermal design of the IC package for a number of reasons. First, the internal thermal resistance (junction-case) of a low-power HBM is usually higher than that of a high-power ASIC. ...

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Abstract

While the use of 2.5D / 3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D / 3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Description

[0001] related application [0002] This application claims priority and benefit to U.S. Patent Application No. 15 / 696,962, filed September 6, 2017, entitled "THERMOELECTRIC COOLER (TEC) FOR SPOTCOOLING OF 2.5D / 3D IC PACKAGES," the entire contents of which are owned by Incorporated herein by reference for this purpose. Background technique [0003] High Bandwidth Memory (HBM) provides memory bandwidth far beyond what conventional memory devices such as DDR4 and GDDR5 can provide, and saves cost and power. HBM is designed as in-package memory and is usually located next to the processor or ASIC. Multiple HBM components can be integrated with a single ASIC by using 2.5D / 3D packaging technology. While using 2.5D / 3D packaging technology results in compact IC packages, it also presents challenges for thermal management. Contents of the invention [0004] According to one aspect, the subject matter described in this disclosure is directed to an integrated component package incl...

Claims

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Application Information

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IPC IPC(8): H01L23/38
CPCH01L23/473H01L2924/1433H01L2924/1434H01L23/38H01L25/18H01L23/053H01L23/433H01L25/50H01L21/52H01L21/4882F25B21/02F25B2321/023F25B2321/0251
Inventor 梅勒妮·博谢敏马德胡苏丹·延加尔克里斯托弗·马隆格雷戈里·里姆瓦尔
Owner GOOGLE LLC
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