The utility model provides a novel structure capable of improving bending of memory particles. The novel structure comprises a
chip layer, a substrate layer and a
solder ball layer which are sequentially arranged from top to bottom, the substrate layer comprises a
chip pasting end, a substrate main body end and a
solder ball pasting end which are sequentially arranged from top to bottom; cCL laminated boards and glass fibers are arranged in the base board main body end, the glass fibers are arranged in the CCL laminated boards in a wave-shaped embedded mode, and the thickness of each single-layer CCL laminated board is 43 micrometers. On the basis of a
chip layer, a substrate layer and a
solder ball layer structure of a
conventional memory, the substrate main body adopts a
composite structure of the CCL laminated board and the glass fibers, and the thickness of the CCL laminated board reaches 43 microns, so that the effect of improving the overall rigidity of the substrate can be achieved, the shrinkage degree of the substrate is reduced, the bending of the substrate is effectively controlled, and the service life of the substrate is prolonged. And the
mass production level and the product
evaluation result are met, and the target of on-time
mass production is achieved.