Efficient vacuum electroplating device with mixed plating

Abstract

The invention belongs to the technical field of vacuum electroplating, and discloses an efficient vacuum electroplating device with mixed plating. The device comprises a base plate; a first pipe bodyis mounted at the top of the base plate; one side of the base plate is rotationally connected with a second pipe body; sealing pads are mounted on the inner walls of the second pipe body and the firstpipe body; a film thickness meter is mounted in the position, near one side of the sealing pad, of the inner wall of the first pipe body; a heating pipe is mounted on the lower side, near the film thickness meter, in the first pipe body; and a crucible is mounted on the lower side, near the heating pipe, in the first pipe body. A rotating shaft and a connecting rod are clamped through an insertion rod; one end of the insertion rod is clamped and fixed through a bolt; when the connecting rod needs to be taken out to place targets, the insertion rod and the bolt only need to be pulled out, so that users can once place the targets on the connecting rod; and the connecting rods can be taken out for once placement, so that the target placement difficulty is greatly reduced, and the target placement efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of vacuum electroplating, and in particular relates to a high-efficiency vacuum electroplating device with mixed plating. Background technique [0002] Vacuum plating is a physical deposition phenomenon. There are several types of vacuum evaporation, sputtering and ion plating. They all use vacuum conditions to deposit various metal and non-metal films on the surface of plastic parts by means of distillation or sputtering. advantage. [0003] In the Chinese patent No. "CN201720345557.8", a high-efficiency vacuum electroplating device with mixed plating is disclosed. The patent describes that "the turntable is driven by a stepping motor, so that the cylindrical rake is rotated and electroplated, which can cover the product. Any surface, reasonable structure, convenient function and use, suitable for widespread promotion", although the device proposed in this patent can rotate and electroplate the target, bu...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-efficiency vacuum electroplating device with mixed plating to solve the above-mentioned background technology. The difficulty of placing the target reduces the efficiency of the placement of the target and the specifications of the placement structure cannot be adjusted according to the needs of the user, and the range of use of the device is limited.

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